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Volumn 516, Issue 19, 2008, Pages 6677-6682

Cu films deposition by dielectric barrier discharge in supercritical CO2, Ar and Xe environments

Author keywords

Chemical fluid deposition; Cu film; Dielectric barrier discharge; Microplasma; Supercritical Ar; Supercritical CO2; Supercritical fluid; Supercritical Xe

Indexed keywords

COBALT; COBALT ALLOYS; COBALT COMPOUNDS; COPPER ALLOYS; METALLIC FILMS; PLASMAS;

EID: 45549109761     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.11.042     Document Type: Article
Times cited : (10)

References (20)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.