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Volumn 516, Issue 19, 2008, Pages 6677-6682
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Cu films deposition by dielectric barrier discharge in supercritical CO2, Ar and Xe environments
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Author keywords
Chemical fluid deposition; Cu film; Dielectric barrier discharge; Microplasma; Supercritical Ar; Supercritical CO2; Supercritical fluid; Supercritical Xe
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Indexed keywords
COBALT;
COBALT ALLOYS;
COBALT COMPOUNDS;
COPPER ALLOYS;
METALLIC FILMS;
PLASMAS;
CU(TI) FILM;
DIELECTRIC BARRIER DISCHARGE (DBD);
HIGH RATE DEPOSITION;
SUPER-CRITICAL;
COPPER;
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EID: 45549109761
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2007.11.042 Document Type: Article |
Times cited : (10)
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References (20)
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