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Volumn 38, Issue 12, 2009, Pages 2762-2769
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Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages
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Author keywords
BGA packages; Dynamic fatigue test; Rare earth doped solder; Tin whiskers
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Indexed keywords
BALL GRID ARRAY PACKAGES;
BGA PACKAGE;
BULK MATERIALS;
BULK SOLDER;
DYNAMIC FATIGUE;
ELECTROLESS NICKEL/IMMERSION GOLDS;
FATIGUE LIFE;
FATIGUE RELIABILITY;
IMMERSION TINS;
METALLOGRAPHIC OBSERVATIONS;
ORGANIC SOLDERABILITY PRESERVATIVE;
RARE-EARTH DOPING;
RELIABILITY TEST;
SNAGCU SOLDER;
SOLDER BALLS;
SOLDER JOINTS;
SURFACE FINISHES;
TENSILE TESTS;
TIN WHISKER;
ULTIMATE TENSILE STRENGTH;
WHISKER GROWTH;
YOUNG'S MODULUS;
ALLOYS;
BALL GRID ARRAYS;
CERIUM;
CERIUM ALLOYS;
CERIUM COMPOUNDS;
COPPER ALLOYS;
CRYSTAL WHISKERS;
DOPING (ADDITIVES);
FATIGUE TESTING;
MECHANICAL PROPERTIES;
PACKAGING;
RELIABILITY;
SILVER;
SILVER ALLOYS;
SOLDERED JOINTS;
SOLDERING;
SOLDERING ALLOYS;
TENSILE STRENGTH;
TENSILE TESTING;
TIN ALLOYS;
TIN;
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EID: 72549107357
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-009-0912-2 Document Type: Article |
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Times cited : (7)
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References (11)
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