Wafer-to-wafer hybrid bonding technology for 3D IC

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Ko, Cheng Ta ^a,b   Hsiao, Zhi Cheng ^a   Fu, Huan Chun ^a   Chen, Kuan Neng ^a,b   Lo, Wei Chung ^a   Chen, Yu Hua ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; APPLICATION RANGE; BONDING ADHESIVE; BONDING PROPERTY; BONDING QUALITY; EUTECTIC BONDING; EVALUATION RESULTS; HYBRID BONDING; HYBRID SCHEME; MATERIAL CANDIDATE; METAL BONDING; MICRO GAPS; ON-WAFER; PAD SIZES; POLYMER MATERIALS; THERMO COMPRESSION BONDING; WAFER LEVEL; WHOLE PROCESS;

HYBRID MATERIALS; POLYMERS; TECHNOLOGY; THREE DIMENSIONAL; TIN;

WAFER BONDING;

EID: 78651335467     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642848     Document Type: Conference Paper

References (11)

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