Multiparameter sensitivity analysis of multiple coupled vias in board and package structures for early design and optimization

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 4, 2010, Pages 1003-1011

  Li, Ying ^a   Jandhyala, Vikram ^a  

^a University of Washington   (United States)

Author keywords

Interconnects; scattering matrix; sensitivity analysis; vias

Indexed keywords

ANALYTICAL EXPRESSIONS; DESIGN AND OPTIMIZATION; EXTERIOR PROBLEM; FIELD SIMULATION; FINITE DIFFERENCE APPROXIMATIONS; FIRST DERIVATIVE; GRADIENT-BASED OPTIMIZATION; INTERCONNECTS; MATERIAL VARIATION; MICROELECTRONICS SYSTEMS; MULTI-PARAMETER SENSITIVITY ANALYSIS; MULTIPARAMETRIC SENSITIVITY ANALYSIS; PACKAGE STRUCTURE; SCATTERING MATRIX; STEPPING STONE; SYSTEM-LEVEL PERFORMANCE; VIA DRILLING; VIAS;

DESIGN; ELECTRIC CONVERTERS; MICROELECTRONICS; OPTIMIZATION; PACKET NETWORKS; SCATTERING PARAMETERS; THREE DIMENSIONAL;

SENSITIVITY ANALYSIS;

EID: 78651307686     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2010.2047723     Document Type: Article

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