Introduction of nanosized Al2O3 in Sn-Ag3,5 solders by mechanical alloying

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Boareto, J C ^a   Rodrigues, G V S ^b   Mastropietro, M F ^b   Wendhausen, P A P ^b   Wolter, K J ^c  

^a FEDERAL UNIVERSITY OF SANTA CATARINA   (Brazil)

^b CERTI Foundation   (Brazil)

^c DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC MICROSCOPY; HIGH ENERGY MILLING; MICROSTRUCTURE HOMOGENEITY; NANO-PARTICLE DISPERSIONS; NANO-SIZED; SOLDER ALLOYS; WEIGHT PERCENT;

MECHANICAL ALLOYING; METALLURGY; MICROSTRUCTURE; NANOPARTICLES; SILVER; SOLDERING ALLOYS; TIN ALLOYS; X RAY DIFFRACTION;

TIN;

EID: 78651274716     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642940     Document Type: Conference Paper

References (14)

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