LED and optical device packaging and materials

Materials for Advanced Packaging

Volumn , Issue , 2009, Pages 629-680

  Lin, Yuan Chang ^a   Zhou, Yan ^a   Tran, Nguyen T ^a   Shi, Frank G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

encapsulant; Light emitting diode (LED); optoelectronic; packaging; reliability

Indexed keywords

EID: 78651108500     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-0-387-78219-5_18     Document Type: Chapter

References (67)

1. E. Fred Schubert, "Light-emitting diodes", Cambridge: Cambridge University Press, 2nd ed., 2006
2. "LED lighting technology: lessons from the USA", Report of a DTI global watch mission, March 2006
3. C. W. Wessner, "Partnership for solid-state lighting: Report of a workshop", Washington, DC: National Academy Press, pp. 58-61, 2002
4. F. M. Steranka et al., "High power LEDs - Technology status and market applications", Physica Status Solidi (A), Vol. 194, No. 2, pp. 380-388, 2002
5. R. J. M. Zwiers et al., "Development of a new low-stress hyperred LED encapsulant," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 3, pp. 387-392, 1989
6. M. Edwards et al., "Comparative properties of optically clear epoxy encapsulants", Proceeding of the SPIE, International Society for Optical Engineering, Vol. 4436, pp. 190-197, 2004
7. Y. Morita, "Cationic polymerization of hydrogenated bisphenol-A glycidyl ether with cycloaliphatic epoxy resin and its thermal discoloration", Journal of Applied Polymer Science, Vol. 97, pp. 1395-1400, 2005
8. J. C. Huang, "Comparison of epoxy resins for applications in light-emitting diodes", Advances in Polymer Technology, Vol. 23, No. 4, pp. 298-306, 2004
9. Y. Morita, "Curing of epoxy siloxane monomer with anhydride," Journal of Applied Polymer Science, Vol. 97, No. 3, pp. 946-951, 2005
10. Y. Zhou et al., "Optical nanocomposite materials for photonic packaging," Proceedings of PhoPack, pp. 34-36, 2003
11. Y.C. Lin et al., "Materials challenges and solutions for the packaging of high power LEDs", International Microsystems, Packaging, Assembly Conference Taiwan, pp. 1-4, 2006
12. C.P. Wong, "Thermal-mechanical enhanced high-performance silicone gels and elastomeric encapsulants in microelectronic packaging", IEEE Transactions on Components Packaging and Manufacturing Technology (PART A), Vol. 18, No. 2, pp. 270-273, 1995
13. J. H. Lau et al., "Electronic packaging: design, materials, process, and reliability", New York : McGraw-Hill, 1998
14. H. Luo et al., "Analysis of high-power packages for phosphor-based white-light-emitting diodes", Applied Physics Letters, Vol. 86, No. 24, 243505, 2005
15. M. Rossi et al., "Micro-optics promote use of LEDs in consumer goods", LED Magazine, 2005
16. J. P. Dakin et al., "Handbook of Optoelectronics", New York: Taylor & Francis, 2006
17. R. N. Kumar et al., "Ultraviolet radiation curable epoxy resin encapsulant for light emitting diodes", Journal of Applied Polymer Science, Vol. 100, No. 2, pp. 1048-1056, 2006
18. Y. Zhou et al., "Epoxy-based optically transparent nanocomposites for photonic packaging", Proceedings of Advanced Packaging Materials: Process, Properties and Interfaces, 9th international symposium, pp. 100-102, 2004
19. Y. Morita et al., "Thermal initiated cationic polymerization and properties of epoxy siloxane", Journal of Applied Polymer Science, Vol. 100, pp. 2010-2019, 2006
20. Y. Zhou et al., "One component, low temperature and fast cure epoxy encapsulant with high refractive index for LED applications", IEEE Transactions on Advanced Packaging, Vol. 31, No. 3, pp. 484-489, 2008
21. US Patent 6,713,571, Mar.30, 2004
22. US. 20060204760, Sep.14, 2006
23. US patent 7,125,917, Oct.24, 2006
24. L. Rector et al., "Molding transforms to meet advanced market requirements", Advanced Packaging, 2007
25. D.A. Steigerwald et al., "Illumination with solid state lighting technology", IEEE Journal of Selected Topics in Quantum Electronics, Vol. 8, No. 2, pp. 310-320, 2002
26. A. Bergh et al., "The promise and challenge of solid-state lighting", Physics Today, Vol. 54, No. 12, pp. 42-47, 2001
27. S. Chhajed et al., "Influence of junction temperature on chromaticity and color-rendering properties of trichromatic white-light sources based on light-emitting diodes", Journal of Applied Physics, Vol. 97, No. 5, Art. No. 054506, 2005
28. M. Yamada et al., "A methodological study of the best solution for generating white light using nitride-based light-emitting diodes", IEICE Transactions on Electronics, E88C, No. 9, pp. 1860-1871, 2005
29. F. M. Steranka et al., "High power LEDs - Technology status and market applications", Physica Status Solidi (A), Applied Research, Vol. 194, No. 2, pp. 380-388, 2002
30. E. F. Schubert et al., "Solid-state lighting - a benevolent technology", Reports on Progress in Physics, Vol. 69, No. 12, pp. 3069-3099, 2006
31. E. F. Schubert et al., "Solid-state light sources getting smart", Science, pp. 1274-1278, 2005
32. M. S. Shur et al., "Solid-state lighting: Toward superior illumination", Proceedings of the IEEE, Vol. 93, No. 10, pp. 1691-1703, 2005
33. "Lumileds delivers white LEDs with patented conformal coating ", LED magazine, 2005
34. N. T. Tran, "Simulation studies for the design and manufacturing of optical sensors and white light emitting devices", PhD Dissertation.
35. N. Narendran, Y. Gu, J. P. Freyssinier-Nova, and Y. Zhu, "Extracting phosphorscattered photons to improve white LED efficiency", Physica Status Solidi (A), Vol. 202, No. 6, pp. R60-R62, 2005
36. N. Narendran, "Improved performance white LED", Fifth International Conference on Solid State Lighting, Proceedings of SPIE, Vol. 5941, pp. 45-50, 2005
37. "Cyberlux acquires rights to remote phosphor technology", LED magazine, 2006
38. US. 20060181192, Aug. 17, 2006
39. US. 7045956, May. 16, 2006
40. US. 6791259, Sep. 14, 2004
41. "CAB-O-SIL1 Untreated Fumed Silica Properties and Functions", Cabot Corp, www.cabot-corp.com
42. A. Norris, M. Bahadur, and M. Yoshitake, "Silicone materials development for LED packaging", Dow Corning Corporation
43. A. W. Norris et al., "Novel silicone materials for LED packaging", Proceedings of SPIE, Vol. 5941, 594115, Sep. 14, 2005
44. W. Noll, "Chemistry and technology of silicones", New York: Academic Press, 1968
45. R. Jones et al., "Silicon-containing polymers", Dordrecht: Kluwer Academic Publishers, 2000
46. S. Clarkson et al., "Siloxane polymers", New Jersey: PTR Prentice Hall, 1993
47. W. Lynch, "Handbook of silicone rubber fabrication", New York: Van Nostrand Reinhold Company, 1978
48. A. Norris et al., "Silicone materials development for LED packaging", LED Magazine, 2006
49. Y. Li et al., "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications", Materials Science and Engineering R, Vol. 51, pp. 1-35, 2006
50. K. Gilleo, in: J.S. Hwang (Ed.), "Environment-friendly electronics: Lead-free technology, electrochemical publications Ltd., Port Erin, UK, 2001 (Chapter 24)
51. M. Abtew et al., "Lead-free solders in microelectronics", Materials. Science and Engineering R, Vol. 27, pp. 95-141, 2000
52. W. C. Wu et al., "Investigation on the long term reliability of power IGBT modules", Proceedings of the International Symposium Power Semiconductor Devices and ICs, Yokohama, Japan, 1995
53. L. H. U. Andersson et al., "Silicone elastomers for electronic application. I. Analyses of the noncrosslinked fractions", Journal of Applied Polymer Science, Vol. 88, pp. 2073-2081, 2003
54. J. Petroski, "Cooling High Brightness LEDs: Developments, Issues, and Challenges" Next Generation Thermal Management Materials and Systems Conference, June 15-17, 2005.
55. F. Wall, "Bringing it all together-the basics of building an LED module/assembly", IMAPS Advanced Technology Workshop on Power LED Packaging and Assembly, Palo Alto CA, USA, Oct. 26-28, 2005
56. J. Kolbe, "Benefits of insulated metal substrates in high power LED application", IMAPS Advanced Technology Workshop on Power LED Packaging and Assembly, Palo Alto CA, USA, Oct. 26-28, 2005
57. D. Saums, "Developments in CTE-Matched, High Thermal Conductivity Composite Baseplate Materials for Power LED Packaging", IMAPS Advanced Technology Workshop on Power LED Packaging and Assembly, Palo Alto CA, USA, Oct. 26-28, 2005
58. A. Roth et al., "Direct copper bonded substrates for use with Power LEDs", IMAPS Advanced Technology Workshop on Power LED Packaging and Assembly, Palo Alto CA, USA, Oct. 26-28, 2005
59. J. D. Hwang, "The Status and Development of LED Thermal Enhanced Substrate", www.materialsnet.com.tw, Vol. 231, 2006
60. "Understanding Power LED Lifetime Analysis", white paper, Philips Lumileds Lighting, San Jose, CA, USA
61. "Luxeon Reliability", Application Brief, Philips Lumileds Lighting, San Jose, CA, USA
62. N. Narendran et al., "Solid-state lighting: failure analysis of white LEDs", Journal of Crystal Growth, Vol. 268, No. (3-4), pp. 449-456, 2004
63. S. Todoroki et al., "Temperature distribution along the striped active region in highpower GaAlAs visible lasers", Journal of Applied Physics, Vol. 58, pp. 1124-1128, 1985
64. S. Murata et al., "Adding a heat bypass improves the thermal characteristics of a 50 mm spaced 8-beam laser diode array", Journal of Applied Physics, Vol. 72, pp. 2514-2516, 1992
65. P. W. Epperlein et al., "Influence of the vertical structure on the mirror facet temperatures of visible GaInP quantum well lasers", Applied Physics Letters, Vol. 62, pp. 3074-3076, 1993
66. D. C. Hall et al., "Technique for lateral temperature profiling in optoelectronic devices using a photoluminescence microprobe", Applied Physics Letters, Vol. 61, pp. 384-386, 1992
67. Y. Xi et al., "Junction and carrier temperature measurements in deep-ultraviolet lightemitting diodes using three different methods", Applied Physics Letters, Vol. 86, pp. 031907-031909, 2005