Molding transforms to meet advanced market requirements

Advanced Packaging

Volumn 16, Issue 7, 2007, Pages 38-41

  Rector, Louis ^a   Goh, Kok Soo ^a   Liang, Shawn ^a  

^a Electronics Group of Henkel   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASYMMETRIC PACKAGES; GREEN MATERIAL ADOPTION; HIGH-VOLUME MANUFACTURING; LAMINATE ARRAYS; SYSTEM-IN-PACKAGES;

BALL GRID ARRAYS; ELECTRONICS PACKAGING; EPOXY RESINS; THERMOSTATS;

TRANSFER MOLDING;

EID: 35648998574     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)