Low-cost antenna-in-package solutions for 60-GHz phased-array systems

2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

Volumn , Issue , 2010, Pages 93-96

  Kam, Dong Gun ^a   Liu, Duixian ^a   Natarajan, Arun ^a   Reynolds, Scott ^a   Floyd, Brian A ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b North Carolina State University   (United States)

Author keywords

60 GHz; Antenna in package; Millimeter wave package; Phased array antennas

Indexed keywords

BALL GRID ARRAYS; CHIP SCALE PACKAGES; COSTS; FLIP CHIP DEVICES; MICROELECTRONICS; MICROSTRIP ANTENNAS; MICROWAVE ANTENNAS; MILLIMETER WAVES; PRINTED CIRCUIT BOARDS; SLOT ANTENNAS; TEMPERATURE; TRANSMITTERS;

60 GHZ; ANTENNA IN PACKAGES; LOW-TEMPERATURE CO-FIRED CERAMIC TECHNOLOGIES; MANUFACTURING COST; PHASED ARRAY ANTENNAS; PHASED ARRAY SYSTEMS; PHASED-ARRAY TRANSMITTER; TRANSMITTER AND RECEIVER;

ANTENNA PHASED ARRAYS;

EID: 78650961727     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEPS.2010.5642554     Document Type: Conference Paper

References (19)

1. S. Reynolds, B. Floyd, U. Pfeiffer, T. Beukema, J. Grzyb, C. Haymes, B. Gaucher, and M. Soyuer, "A silicon 60-GHz receiver and transmitter chipset for broadband communications," IEEE J. Solid-State Circuits, vol. 41, no. 12, pp. 2820-2831, Dec. 2006.
2. Y. Zhang and D. Liu, "Antenna-on-chip and antenna-in-package solutions to highly integrated millimeter-wave devices for wireless communications," IEEE Trans. Antennas and Propagation, vol. 57, no. 10, pp. 2830-2841, Oct. 2009.
3. J. Grzyb, D. Liu, U. Pfeiffer, and B. Gaucher, "Wideband cavity-backed folded dipole superstrate antenna for 60 GHz applications," in Proc. 2006 IEEE Symp. on Antennas and Propagation, pp. 3939-3942.
4. U. Pfeiffer, J. Grzyb, D. Liu, B. Gaucher, T. Beukema, B. Floyd, and S. Reynolds, "A chip-scale packaging technology for 60-GHz wireless chipsets," IEEE Trans. Microwave Theory and Techniques, vol. 54, no. 8, pp. 3387-3397, Aug. 2006.
5. S. Reynolds, A. Valdes-Garcia, B. Floyd, T. Beukema, B. Gaucher, D. Liu, N. Hoivik, and B. Orner, "Second generation 60-GHz transceiver chipset supporting multiple modulations at Gb/s data rates," IEEE Bipolar/BiCMOS Circuits and Technology Meeting, pp. 192-197, Oct. 2007.
6. A. Natarajan, A. Komijani, X. Guan, A. Babakhani, and A. Hajimiri, "A 77-GHz phased-array transceiver with on-chip antennas in silicon: transmitter and local LO-path phase-shifting," IEEE J. of Solid-State Circuits, vol. 41, no. 12, pp. 2807-2819, Dec. 2006.
7. K. Koh, J. May, and G. Rebeiz, "A millimeter-wave (40-45 GHz) 16-element phased-array transmitter in 0.18-um SiGe BiCMOS technology," IEEE J. of Solid-State Circuits, vol. 44, no. 5, pp. 1498-1509, May 2009.
8. E. Cohen, C. Jakobson, S. Ravid, and D. Ritter, "A bidirectional TX/RX four-element phased array at 60 GHz with RF-IF conversion block in 90-nm CMOS process," IEEE Trans. Microwave Theory and Techniques, vol. 58, no. 5, pp. 1438-1446, May 2010.
9. Y. Zhang, M. Sun, K. Chua, L. Wai, and D. Liu, "Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios," IEEE Trans. Antennas and Propagation, vol. 57, no. 10, pp. 2842-2852, Oct. 2009.
10. D. Jung, W. Chang, K. Eun, and C. Park, "60-GHz system-on-package transmitter integrating sub-harmonic frequency amplitude shift-keying modulator," IEEE Trans. Microwave Theory and Techniques, vol. 55, no. 8, pp. 1786-1793, Aug. 2007.
11. A. Lamminen, J. Saily, and A. Vimpari, "60-GHz patch antennas and arrays on LTCC with embedded-cavity substrates," IEEE Trans. Antennas and Propagation, vol. 56, no. 9, pp. 2865-2874, Sep. 2008.
12. A. Valdes-Garcia, S. Nicolson, J.-W. Lai, A. Natarajan, P.-Y. Chen, S. Reynolds, J.-H. Zhan, and B. Floyd, "A SiGe BiCMOS 16-element phased-array transmitter for 60GHz communications," IEEE ISSCC Dig. Tech. Papers, Feb. 2010, pp. 218-219.
13. S. Reynolds, A. Natarajan, M.-D. Tsai, S. Nicolson, J.-H. Zhan, D. Liu, D. Kam, O. Huang, A. Valdes-Garcia, and B. Floyd, "A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS," IEEE RFIC Symp. Dig. Tech. Papers, May 2010, pp. 461-464.
14. E. Pillai, "Coax via - a technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling," IEEE Trans. Microwave Theory and Techniques, vol. 45, no. 10, pp. 1981-1985, Oct. 1997.
15. D. Liu, H. Chen, and B. Floyd, "An LTCC superstrate patch antenna for 60-GHz package applications," 2010 IEEE Symp. on Antennas and Propagation.
16. N. Kingsley, "Liquid crystal polymer: enabling next-generation conformal and multilayer electronics," Microwave Journal, vol. 51, no. 5, pp. 188-200, May 2008.
17. D. Liu, J. Akkermans, H. Chen, and B. Floyd, "Packages with integrated 60-GHz aperture-coupled patch antennas," IEEE Trans. Antennas and Propagation, to be published.
18. J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim, "Modeling and measurement of simultaneous switching noise coupling through signal via transition," IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559.
19. D. Kam and J. Kim, "40-Gb/s package design using wire-bonded plastic ball grid array," IEEE Trans. Advanced Packaging, vol. 31, no. 2, pp. 258-266, May 2008.