Antenna-on-chip and antenna-in-package solutions to highly integrated millimeter-wave devices for wireless communications

IEEE Transactions on Antennas and Propagation

Volumn 57, Issue 10 PART 1, 2009, Pages 2830-2841

  Zhang, Y P ^a   Liu, Duixian ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

60 GHz; Antennas; Liquid crystal polymer (LCP); Low temperature cofired ceramic (LTCC)

Indexed keywords

60-GHZ RADIO; ANTENNA GAINS; ANTENNA IN PACKAGES; COMPENSATION SCHEME; ECONOMIC PERSPECTIVE; ELECTROMAGNETIC INTERFERENCE; FLIP CHIP; GHZ BAND; HIGH PERMITTIVITY; HIGHLY INTEGRATED; LINK BUDGET ANALYSIS; LIQUID CRYSTAL POLYMER (LCP); LOW LOSS; LOW RESISTIVITY; LOW-TEMPERATURE CO-FIRED CERAMICS; MM-WAVE; OHMIC LOSS; ON CHIPS; SILICON SUBSTRATES; SYSTEM DESIGNERS; SYSTEMS LEVELS; WIREBONDING; WIRELESS COMMUNICATIONS;

CERAMIC MATERIALS; ELECTROMAGNETIC PULSE; LAWS AND LEGISLATION; LIQUID CRYSTALS; METAL CLADDING; MILLIMETER WAVE DEVICES; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SURFACE WAVES; WIRELESS TELECOMMUNICATION SYSTEMS;

ANTENNAS;

EID: 77949820687     PISSN: 0018926X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TAP.2009.2029295     Document Type: Article

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