Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios

IEEE Transactions on Antennas and Propagation

Volumn 57, Issue 10 PART 1, 2009, Pages 2842-2852

  Zhang, Y P ^a   Sun, M ^a   Chua, K M ^b   Wai, L L ^b   Duixian, Liu ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

60 GHz radio; Antenna in package (AiP); Low temperature cofired ceramic (LTCC)

Indexed keywords

60-GHZ RADIO; ANTENNA COUPLING; ANTENNA IN PACKAGES; ASSEMBLY TECHNIQUES; CERAMIC BALL GRID ARRAYS; DESIGN METHOD; GUARD-RINGS; HIGH-SPEED; HIGHLY INTEGRATED; IMPEDANCE BANDWIDTHS; INPUT IMPEDANCE; LOW LOSS; LOW-TEMPERATURE CO-FIRED CERAMICS; MILLIMETER-WAVE (MM-WAVE); NEW SOLUTIONS; ONCHIP INDUCTORS; RADIO CHIPS; WIREBOND; WIREBONDING; WIRELESS COMMUNICATIONS; WORST CASE;

ANTENNA ARRAYS; CERAMIC MATERIALS; CHIP SCALE PACKAGES; DESIGN; ELECTRIC IMPEDANCE; ELECTRONIC EQUIPMENT MANUFACTURE; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SLOT ANTENNAS; WIRE; WIRELESS TELECOMMUNICATION SYSTEMS;

PACKAGING;

EID: 77949829315     PISSN: 0018926X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TAP.2009.2029290     Document Type: Article

References (38)

1. S. K. Moore, "Cheap chips for next wireless frontier," IEEE Spectrum, pp. 8-9, Jun. 2006.
2. K. Ohata et al., "1.25 Gbps wireless Gigabit Ethernet link at 60 GHzband," in IEEE MTT-S Int. Microwave Symp. Dig., Philadelphia, PA, Jun. 8-13, 2003, pp. 373-376.
3. S. E. Gunnarsson et al., "60 GHz single-chip front-end MMICs and systems for multi-Gb/s wireless communication," IEEE J. Solid-State Circuits, vol.42, no.5, pp. 1143-1157, May 2007.
4. B. Floyd, S. Reynolds, U. Pfeiffer, T. Beukema, J. Grzyb, and C. Haymes, "A silicon 60 GHz receiver and transmitter chipset for broadband communications," in IEEE ISSCC Dig. Tech. Papers, San Francisco, CA, Feb. 2006, pp. 184-185.
5. B. Razavi, "A 60-GHz CMOS receiver front-end," IEEE J. Solid-State Circuits, vol.41, no.1, pp. 17-22, Jan. 2006.
6. M. Toshiya et al., "A 60-GHz CMOS receiver with frequency synthesizer," in IEEE Symp. VLSI Dig. Tech. Papers, Kyoto, Japan, Jun. 14-16, 2007, pp. 172-173.
7. M. Varonen, M. Kärkkäinen, and K. A. I. Halonen, "Millimeter-Wave Amplifiers in 65-nm CMOS," in Proc. ESSCIRC, Munich, Germany, Sep. 10-14, 2007, pp. 280-283.
8. Y. P. Zhang, L. H. Guo, and M. Sun, "On-chip antennas for 60-GHz radios in silicon technology," IEEE Trans. Electron Devices, vol.52, no.6, pp. 1664-1668, Jul. 2005.
9. K. T. Chan, A. Chin, Y. P. Chen, Y. D. Lin, T. S. Duh, and W. J. Lin, "Integrated antennas on Si, proton-implanted Si and Si-on-quartz," in IEDM Tech. Dig., Washington, DC, Dec. 3-5, 2001, pp. 903-906.
10. J. G. Kim, H. S. Lee, H. Lee, J. B. Yoon, and S. Hong, "60-GHz CPW-fed post-supported patch antenna using micromachining technology," IEEE Microw. Wireless Compon. Lett., vol.15, no.10, pp. 635-637, Oct. 2005.
11. H. R. Chuang, S. W. Kuo, C. C. Lin, and L. C. Kuo, "A 60-GHz millimeter-wave CMOS RFIC-on-chip dipole antenna," Microw. J., vol.50, no.1, pp. 144-144, Jan. 2007.
12. C. S. Wang, J. W. Huang, S. H. Wen, S. H. Yeh, and C. K. Wang, "A CMOS RF front-end with on-chip antenna for V-band broadband wireless communications," in Proc. ESSCIRC, Munich, Germany, Sep. 10-14, 2007, pp. 143-146.
13. M. A. T. Sanduleanu and J. R. Long, "CMOS integrated transceiver for 60GHz UWB communication," in Proc. IEEE Int. Conf. Ultra-Wideband (ICUWB), Singapore, Sep. 24-26, 2007, pp. 508-513.
14. Y. P. Zhang, "Integration of microstrip antenna on ceramic ball grid array package," Electron. Lett., vol.38, no.1, pp. 14-16, 2002.
15. Y. P. Zhang, "Integration of microstrip antenna on cavity-down ceramic ball grid array package," Electron. Lett., vol.38, no.22, pp. 1307-1308, 2002.
16. U. Pfeiffer, J. Grzyb, D. Liu, B. Gaucher, T. Beukema, B. Floyd, and S. Reynolds, "A chip-scale packaging technology for 60-GHz wireless chipsets," IEEE Trans. Microw. Theory Tech., vol.54, no.8, pp. 3387-3397, Aug. 2006.
17. U. Pfeiffer, J. Grzyb, D. Liu, B. Gaucher, T. Beukema, B. Floyd, and S. Reynolds, "A 60-GHz radio chipset fully-integrated in a low-cost packaging technology," in Proc. 56th Electron. Compon. Technol. Conf., San Diego, CA, Jun. 2, 2006, pp. 1343-1346.
18. T. Zwick, D. Liu, and B. Gaucher, "Broadband planar superstrate antenna for integrated millimeter-wave transceivers," IEEE Trans. Antennas Propag., vol.54, no.10, pp. 270-2796, Oct. 2006.
19. Y. Tsutsumi et al., "A triangular loop antenna mounted adjacent to a lossy Si substrate for millimeter-wave wireless PAN," in Proc. IEEE Antenna Propag. Symp., Honolulu, HI, Jun. 10-15, 2007, pp. 1008-1011.
20. T. Seki, K. Nishikawa, I. Toyoda, and K. Tsunekawa, "Millimeterwave high-efficiency multilayer parasitic microstrip antenna array for system-on-package," NTT Tech. Rev., vol.3, no.9, pp. 33-40, Sep. 2005. (Pubitemid 41680360)
21. Y. C. Lee, W. Chang, and C. S. Park, "Monolithic LTCC SiP transmitter for 60 GHz wireless communication terminals," in IEEE MTT-S Int. Microwave Symp. Dig., Long Beach, CA, Jun. 12-17, 2005, pp. 1015-1018.
22. L. Desclos, "V-band double slot antenna integration on LTCC substrate using thick film technology," Microw. Opt. Technol. Lett., vol.28, no.5, pp. 354-357, Mar. 2001.
23. C. Karnfelt, P. Hallbjorner, H. Zirath, and A. Alping, "High gain active microstrip antenna for 60-GHz WLAN/WPAN applications," IEEE Trans. Microw. Theory Tech., vol.54, no.6, pp. 2593-2603, Jun. 2006.
24. N. H. Hoivic et al., "High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques," in Proc. IEEE Antenna Propag. Symp., Honolulu, HI, Jun. 10-15, 2007, pp. 5043-5046.
25. H. Uchimura, N. Shino, and K. Miyazato, "Novel circular polarized antenna array substrates for 60 GHz-band," in IEEE MTT-S Int. Microwave Symp. Dig., Long Beach, CA, Jun. 12-17, 2005, pp. 1875-1878.
26. J. Lee, N. Kidera, S. Pinel, J. Laskar, and M. Tentzeris, "Fully integrated passive front-end solutions for a V-band LTCC wireless system," IEEE Antenna Wireless Propag. Lett., vol.6, pp. 285-288, 2007.
27. I. Kim, S. Pinel, J. Laskar, and J. G. Yook, "Circularly & linearly polarized fan beam patch antenna arrays on liquid crystal polymer substrate for V-band applications," in Asia-Pacific Microwave Conf. Proc., Suzhou, Jiangsu, China, Dec. 4-7, 2005, vol.4.
28. Y. P. Zhang, M. Sun, K. M. Chua, L. L.Wai, and D. L. B. Gaucher, "Antenna-in-package in LTCC for 60-GHz radio," in Proc. IEEE Int.Workshop on Antenna Technology, Cambridge, U.K., Mar. 21-23, 2007, pp. 279-282.
29. Y. P. Zhang, M. Sun, K. M. Chua, L. L. Wai, and D. Liu, "Integration of slot antenna in LTCC package for 60 GHz radios," Electron. Lett., vol.44, no.5, pp. 330-331, 2008.
30. Y. P. Zhang, "Enhancement of package antenna approach with dual feeds, guard ring, and fence of vias," IEEE Trans. Adv. Packag., vol.32, no.3, pp. 612-618, Aug. 2009.
31. HFSS. Ansoft, Pittsburgh, PA.
32. R. H. Caverly, "Characteristic impedance of integrated circuit bondwires," IEEE Trans. Microw. Theory Tech., vol.34, no.9, pp. 982-984, Sep. 1986.
33. G. Baumann et al., "51 GHz front-end with flip chip and wire bond interconnections from GaAs MMICs to a planar patch antenna," in IEEE MTT-S Int. Microwave Symp. Dig., Orlando, FL, May 16-20, 1995, pp. 1639-1642.
34. T. Krems, W. Haydl, H. Massler, and J. Rudiger, "Millimeter-wave performance of chip interconnections using wire bonding and flip chip," in IEEE MTT-S Int. Microwave Symp. Dig., San Francisco, CA, Jun. 17-21, 1996, pp. 247-250.
35. T. P. Budka, "Wide-bandwidth millimeter-wave bondwire interconnects," IEEE Trans. Microw. Theory Tech., vol.49, no.4, pp. 715-718, Apr. 2001.
36. Y. Sun, S. Glisic, F. Herzel, K. Schmalz, E. Grass, W.Winkler, and R. Kraemer, "An integrated 60 GHz transceiver front end for OFDM in SiGe: BiCMOS," presented at theWirelessWorld Research Forum 16, Shanghai, China, Apr. 26-28, 2006.
37. M. Sun and Y. P. Zhang, "A new bondwire compensation scheme for mm-wave highly-integrated wireless devices," Nanyang Technical Univ., Singapore, NTU Technical Report, 2007.
38. T. Blalack, Y. Leclercq, and C. P. Yue, "On-chip RF isolation techniques," in Proc. Bipolar/BiCMOS Circuits and Technology Meeting, 2002, pp. 205-211.