Lead-Free board surface finishes

Lead-Free Soldering

Volumn , Issue , 2007, Pages 221-269

  Roberts, Hugh ^a   Johal, Kuldip ^a  

^a Atotech USA Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 78650909684     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-0-387-68422-2_9     Document Type: Chapter

References (38)

1. Cemco-FSL (2005) The Newest Surface Finish Alternative: LEAD-FREE HASL - Its Development and Advantages.
2. Sweatman, K (2006) Fact and Fiction in Lead-free Soldering. Global SMT & Packaging.
3. Sweatman, K, Nishimura, T (2006) The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder. Proceedings of IPC Printed Circuits Expo.
4. Fellman, J and Lee S (2005) FAQs about Lead-free HASL; Circuit Board Technologies (www.electronicmaterials.rohmhaas.com).
5. Vianco, P (1998) An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance. Circuit World.
6. Sikorcin, G (2005) Lead-free HASL. Florida CirTech PowerPoint presentation. SMTA Atlanta Chapter.
7. Sun, S., et al. (2006) Novel OSP Coatings for Lead-free Processes. Circuitree.
8. Geiger, D and Shangguan, D (2005) Evaluation of OSP Surface Finishes for Lead-free Soldering. Proceedings of SMTA International.
9. O'Connell, J (2004) Study and recommendations into using lead free printed circuit board finishes at manufacturing in circuit test stage. (www.agilent.com)
10. Lopez, Edwin et al. (2005) Effects of Storage Environments on the Solderability of Immersion Silver Board Finishes with Pb-based and Pb-free Solders. SMTA Journal, Vol. 18, Issue 4.
11. Cullen, D (2004) The Effects of Immersion Silver Circuit Board Surface Finish on Electrochemical Migration. Proceedings of SMTA International.
12. IPC-4553 (June 2005) Specification for Immersion Silver Plating for Printed Circuit Boards.
13. Veale Robert (2005) Reliability of PCB Alternate Surface Finishes in a Harsh Industrial Environment. Proceedings of SMTA International.
14. Cookson Electronics (2005) AlphaSTAR - Enthone's Newest Generation Immersion Silver for PWB. (www.galvanord.dk)
15. th Draft.
16. JEDEC/IPC JP002 (March 2006); Current Tin Whiskers Theory and Mitigation Practices Guideline.
17. Merix Corporation (2006) Comparison of Electroless Ni/Immersion Au vs. Electrolytic Ni/Au. (www.merix.com).
18. Johal, K, et al. (2004) Impacts of Bulk Phosphorous Content of Electroless Nickel Layers to Solder Joint Integrity and their Use as Gold- and Aluminum-Wire Bond Surfaces. Proceedings of SMTA Pan Pacific Microelectronics Symposium.
19. Fields, RJ, Low, SR and Lucey GK (Oct. 1991) Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints. The Metal Science of Joining, Cincinnati, OH, pp. 165-173.
20. Toleno B (2005) PCB Surface Finish Options for Lead-free Manufacturing. EMSNow.
21. Jacobson DM and Humpston G (1989) Gold Coatings for Fluxless Soldering. Gold Bull.
22. Mei, Z, Kaufmann, M, Eslambolchi, A and Johnson P "Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold", Proceedings 48 ECTC, May 1998, p. 952.
23. Johal, K (2001) Study of the Mechanism Responsible for Black Pad Defect on Assembled Electroless Nickel/Immersion Gold PWBs. Proceedings of IPC Printed Circuits Expo.
24. Chan, K, Kwok, WM, Bayes, M (2004) A new generation of electroless nickel immersion gold (ENIG) process for PWB surface finishes, KWPCA Journal, No. 13, pp. 1-7.
25. IPC-4552 (Oct. 2002) Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, Appendix 5.
26. Oda, Y, Masayuki, K, Hashimoto, S (2006) IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead-free Solder. Proceedings of IPC Printed Circuits Expo.
27. Lamprecht, S et al. (2005) Implementing Green PCB Production Processes. The Board Authority, Vol. 6, No. 1.
28. Milad, G and Gudeczauskas, D (2006) Surface Finishes for RoHS Compliance. Board Challenges (and Solutions) for Next Generation Designs; PBR Seminars.
29. Tsukada, K (2005) Development of New Surface Finishing Technology for PKG Substrate with High Bondability. Proceedings of IEEE/CPMT Advanced Packaging Materials Symposium.
30. Johal, K, Roberts, H and Lamprecht, S (2004) Electroless Nickel/Electroless Palladium/Immersion Gold Process For Multi-Purpose Assembly Technology. Proceedings of SMTA International.
31. Coombs, CF Jr. (1996) Printed Circuit Handbook, Fourth Edition; McGraw Hill Publishing.
32. Denman, RD (1996) Soldering to Gold Coatings, ITRI Publication, No. 736.
33. Hashimoto, S, Kiso, M, Oda, Y, Otake, H, Milad, G, and Gudaczauskas, D; (2006) Direct immersion gold (DIG) as a final finish, Proceedings of IPC Printed Circuits Expo.
34. Milad, G and Gudeczauskas (2006) Solder Joint Reliability of Gold Surface Finishes (ENIG, ENEPIG and DIG) for PWB Assembled with Lead Free SAC Alloy. Uyemura Library (www.uyemura.com).
35. Walsh D, Milad, G and Gudeczauskas, D (August 2004) Printed Circuit Boards: Final Finish Options. PF Online. (www.pfonline.com))
36. Bernard, D and Bryant, K (2004) Does PCB Pad Finish Affect Voiding Levels in Lead-Free Assemblies? Proceedings of SMTA International.
37. IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard.
38. IPC Designers Council (September 2005); Lead Free: How Will IPC Standards Change?