Printed circuit boards: Final finish options

Products Finishing (Cincinnati)

Volumn 68, Issue 11, 2004, Pages 50-53

  Walsh, Donald E ^a   Milad, George ^a   Gudeczauskas, Donald ^a  

^a Central Research and Development Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CONTACT; HOT AIR SOLDER LEVELING (HASL); ORGANIC SOLDERABILITY PRESERVATIVES (OSP); SOLDERMASK;

CATALYSIS; DEPOSITION; ELECTROLESS PLATING; INCLUSIONS; LEAD; METAL FINISHING; PH EFFECTS; SOLDERING; THERMAL CYCLING; THICKNESS MEASUREMENT; TIN;

PRINTED CIRCUIT BOARDS;

EID: 3843076279     PISSN: 00329940     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)