The fluidity of the Ni-modified Sn-Cu eutectic lead free solder

IPC - Printed Circuits Expo, Apex, and the Designers Summit 2006: Perfectly Cutting Edge

Volumn 1, Issue , 2006, Pages 316-321

  Sweatman, Keith ^a   Nishimura, Tetsuro ^a  

^a Nihon Superior Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FREEZE OUT; HETEROGENOUS NUCLEATION; LEAD FREE SOLDERS; MOLTEN ALLOY; NI ADDITIONS; PEAK TEMPERATURES; PROCESS TEMPERATURE; REFLOW--SOLDERING; SN-0.7CU; SN-37PB; SN-AG-CU ALLOY; THROUGH HOLE; WAVE SOLDERING;

ALLOYS; COPPER ALLOYS; CUTTING TOOLS; EUTECTICS; EXHIBITIONS; FLIP CHIP DEVICES; FLUIDITY; LEAD; MELTING POINT; MICROSTRUCTURE; PRINTED CIRCUITS; SOLDERING; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS;

TIN;

EID: 84867010275     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. IPC-A-610D. "Acceptability of Electronic Assemblies", IPC, February 2005.
2. Subrahmania Janakiraman, Robert Murcko, Krishnaswami Srihari, Scott J. Anson, PE and James Holton, "Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach", Presented at IPC Printed Circuits Expo, SMEMA Council APEX Designers Summit 04
3. Richard W Heine, Carl R Loper and Philip C Rosenthal, "Principles of Metal Casting", 2nd Edition, 1955, McGraw-Hill Book Company, p200.
4. Ragone, David V, "Factors affecting the fluidity of metals", Doctoral Thesis, Massachusetts Institute of Technology http://hdl.handle.net/ 2027.42/7200
5. Malcolm Warwick, "Implementing Lead Free Soldering- European Consortium Research", Proceedings of SMTAI September 1999.
6. Gregor Jost, Keith Sweatman, Tetsuro Nishimura, "Improving the Performance of the Tin-Copper Eutectic as a Lead-Free Solder", Proceedings of Brasage 2003 Conference, Brest, France 8-10 October 2003
7. th International Conference on Lead Free Electronic Components and Assemblies, Singapore, August 18-19, 2005.
8. Keith Sweatman and Tetsuro Nishimura "The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder, Proceedings of the ECWS 10 Conference, Anaheim, February 22-24, 2005
9. Kazuhiro Nogita, Jonathan Read, Tetsuro Nishimura, Keith Sweatman, Shoichi Suenaga and Arne K. Dahle, "Microstructure control in Sn-0.7mass%Cu Alloys", Materials Transactions, Vol. 46, No. 11 (2005) 2419-2425
10. Japanese Patent No. 3152945, US Patent No. 6180055.