IMC growth study on Ni-P/Pd/Au film and Ni-P/Au film using Sn/Ag/Cu lead free solder

IPC - Printed Circuits Expo, Apex, and the Designers Summit 2006: Perfectly Cutting Edge

Volumn 2, Issue , 2006, Pages 924-929

  Oda, Yukinori ^a   Kiso, Masayuki ^a   Hashimoto, Shigeo ^a   Milad, George ^a   Gudeczauskas, Donald ^a  

^a Central Research and Development Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT BOARDS; ELECTROLESS/IMMERSION PLATING; LEAD FREE SOLDERS; NI DIFFUSION; SN-37PB; SOLDER JOINT RELIABILITY; SOLDER JOINTS; SOLDER MATERIAL; SURFACE FINISHES; TRANSMISSION ELECTRON MICROSCOPE;

CUTTING TOOLS; ELECTRONICS PACKAGING; EXHIBITIONS; FINISHING; METALLIC COMPOUNDS; PRINTED CIRCUITS; TRANSMISSION ELECTRON MICROSCOPY;

FILM GROWTH;

EID: 84867012899     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Chi-Won Hwang, Katsusaki Suganuma. J.Mater. Res., 18,2540, Nov (2003)