Development of new surface finishing technology for PKG substrate with high bondability

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 110-114

  Tsukada, Kiyotaka ^a  

^a IBIDEN CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL STRUCTURE; ELECTROLESS PLATING; METAL FINISHING; NICKEL ALLOYS; PALLADIUM; PHOSPHORS; SUBSTRATES;

ELECTRICAL NOISES; ELECTROLYTIC NICKEL; HIGH TEMPERATURE STORAGE; SURFACE FINISHING TECHNOLOGY FOR;

SURFACE PHENOMENA;

EID: 33746476936     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432058     Document Type: Conference Paper

References (7)

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3. th JIEP annual meeting, (March, 2002, Yokohama Japan), pp. 85-86.
4. F.D.Bruce Houghton, "Solving the ENIG black pad problem: an ITRI report on round 2," IPC Works 99 proceedings, (October, 1999, Minneapolis Minnesota), p. S-04-3-1.
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7. G.Milad, "Printed circuits handbook," 5th edition, McGraw-hill, pp.32.1-32.10