SCOPUS 정보 검색 플랫폼

Advanced Materials Research

Volumn 146-147, Issue , 2011, Pages 1070-1074

Electrochemical migration characteristics of Ag-plated Cu powders in conductive thick film

(4) Liu, Yuanlong a Long, Jinming a Zhu, Xiaoyun a Liu, Wenjing a

a KUNMING UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

Author keywords

Ag plated Cu; Conductive thick film; Electrochemical migration; Galvanic corrosion

Indexed keywords

AG-PLATED CU; CONDUCTIVE THICK FILM; DC BIAS; DENDRITIC GROWTH; ELECTROCHEMICAL MIGRATION; GALVANIC CORROSION; GALVANIC COUPLING; SEM; SILVER POWDERS; SURFACE INSULATION RESISTANCES; WATER DROP; XRD;

COPPER; COPPER POWDER METALLURGY; CORROSION; THICK FILMS;

SILVER;

EID: 78650657583 PISSN: 10226680 EISSN: None Source Type: Book Series
DOI: 10.4028/www.scientific.net/AMR.146-147.1070 Document Type: Conference Paper

Times cited : (11)

References (12)

1
- 33747800312
- S. Yang, J. Wu and A. Christou: Microelectronics Reliability Vol. 46 (2006), p.1915
- (2006) Microelectronics Reliability , vol.46 , pp. 1915
- Yang, S.¹ Wu, J.² Christou, A.³

2
- 84871860040
- (In Chinese)
- X.G. Cao, B.L. Wu: Materials for Mechanical Engineering Vol. 29 (2005), p.31 (In Chinese)
- (2005) Materials for Mechanical Engineering , vol.29 , pp. 31
- Cao, X.G.¹ Wu, B.L.²

3
- 78650660251
- (In Chinese)
- L.Y. Zhong, B.L. Wu and L.Y. He: Paint and Coatings Industry Vol. 33 (2003), p.12 (In Chinese)
- (2003) Paint and Coatings Industry , vol.33 , pp. 12
- Zhong, L.Y.¹ Wu, B.L.² He, L.Y.³

4
- 0029327585
- G.Y. Charles, K.N. Han: Journal of the Electrochemical Society Vol. 142 (1995), p. 1819
- (1995) Journal of the Electrochemical Society , vol.142 , pp. 1819
- Charles, G.Y.¹ Han, K.N.²

5
- 27244448501
- (In Chinese)
- H. Zhu, F.X. Gan: Journal of Chinese Society for Corrosion and Protection Vol. 25 (2005), p. 245 (In Chinese)
- (2005) Journal of Chinese Society for Corrosion and Protection , vol.25 , pp. 245
- Zhu, H.¹ Gan, F.X.²

6
- 46549084168
- J.Y. Jung, S.B. Lee, Y.C. Joo, H.Y. Lee and Y.B. Park: Microelectronic Engineering Vol. 34 (2008), p. 1597
- (2008) Microelectronic Engineering , vol.34 , pp. 1597
- Jung, J.Y.¹ Lee, S.B.² Joo, Y.C.³ Lee, H.Y.⁴ Park, Y.B.⁵

7
- 0029375841
- G. Harsányi: IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A Vol. 18 (1995), p. 602
- (1995) IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A , vol.18 , pp. 602
- Harsányi, G.¹

8
- 0030106143
- J.C. Lin, J.Y. Chan: Materials Chemistry and Physics Vol. 43 (1996), p. 256
- (1996) Materials Chemistry and Physics , vol.43 , pp. 256
- Lin, J.C.¹ Chan, J.Y.²

9
- 0031212224
- T. Takemoto, R.M. Latanision, T.W. Eagar and A. Matsunawa: Corrosion Science Vol. 39 (1997), p. 1415
- (1997) Corrosion Science , vol.39 , pp. 1415
- Takemoto, T.¹ Latanision, R.M.² Eagar, T.W.³ Matsunawa, A.⁴

10
- 84944486508
- G.T. Kohman, H.W. Hermance and Downes: The Bell System Technical Journal Vol. 34 (1995), p. 1115
- (1995) The Bell System Technical Journal , vol.34 , pp. 1115
- Kohman, G.T.¹ Hermance, H.W.² Downes³

11
- 50949090113
- C. Dominkovics, G. Harsányi: Microelectronics Reliability Vol. 48 (2008), p. 1628
- (2008) Microelectronics Reliability , vol.48 , pp. 1628
- Dominkovics, C.¹ Harsányi, G.²

12
- 0023166987
- J.J. Steppan, J.A. Roth, L.C. Hall, D.A. Jeannotte and S.P. Carbone: Journal of the Electrochemical Society: Solid-State Science and Technology, Vol. 134 (1987), p. 175
- (1987) Journal of the Electrochemical Society: Solid-state Science and Technology , vol.134 , pp. 175
- Steppan, J.J.¹ Roth, J.A.² Hall, L.C.³ Jeannotte, D.A.⁴ Carbone, S.P.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.