Corrosion failure of complex electrical conductive matierals filled with copper and silver powders

Journal of the Chinese Society of Corrosion and Protection

Volumn 25, Issue 4, 2005, Pages 245-249

  Zhu, Hua ^a   Gan, Fuxing ^a,b  

^a WUHAN UNIVERSITY   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Corrosion failure; Electrical conductive adhesive; Powder microelectrode; Silver Plated copper

Indexed keywords

COPPER; CORROSION RESISTANCE; SILVER;

EID: 27244448501     PISSN: 10054537     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. Steppan J J, Roth J A. A review of corrosion failure mechanisms during accelerated tests[J].J. Electrochem. Soc., 1987, 134 (1): 175
2. Gao, B J, Jiang H M, et al. A study on the mechanism of micrometer copper powder plated - silver using argentamine solution[J]. Chin. J. Inorganic Chemisity, 2000, 16(4):669
3. Tan F B, Cai Y Z, et al. Chemically silvering copper powder and its properties[J]. Precious Metals, 2000, 21(3):8
4. Zha Q X. Fundamentals of Kinetics of Electrode Processes[M]. Beijing: Science Press, 2002, 368-376
5. Tang H, Fang X F, Luo Y X. A study on conductive mechanism of conductive polymer composites and calculation of resistivity [J]. Polymer Mater. Sci. Eng., 2000, 12(6):1
6. Charles Guan Y, Han Kenneth N. An electrochemical study on the dissolution of copper and silver from silver - copper alloys[J].J. Electrochem. Soc., 1995, 142 (6):1819