3D integration technologies for miniaturized Tire Pressure Monitor System (TPMS)

Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009

Volumn , Issue , 2009, Pages 822-829

  Lietaer, Nicolas ^a   Taklo, Maaike M V ^a   Klumpp, Armin ^b   Weber, Josef ^b   Ramm, Peter ^b  

^a SINTEF   (Norway)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HETEROGENEOUS SYSTEMS; INTEGRATED CIRCUITS (ICS); INTEGRATED DEVICE; MECHANICAL CHARACTERIZATIONS; MECHANICAL INTERCONNECTIONS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); TECHNOLOGICAL CHALLENGES; THROUGH SILICON VIAS;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; ELECTRIC POWER SYSTEMS; GOLD; INTEGRATION; MICROELECTRONICS; SAFETY DEVICES; SOLDERING; WAFER BONDING;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 78650363188     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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