3D integration technologies for wireless sensor systems (e-CUBES)

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

Volumn , Issue , 2008, Pages 189-196

  Ramm, Peter ^a   Taklo, Maaike ^a   Weber, Josef ^b   Wolf, M Jürgen ^c,d  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b SINTEF   (Norway)

^c FRAUNHOFER IZM   (Germany)

^d TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84877268476     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. http://ecubes. org
2. P. Ramm, A. Klumpp, 'Method of vertically integrating electronic components by means of back contacting', US Patent 6,548,391
3. P. Ramm, D. Bonfert, R. Ecke, F. Iberl, A. Klumpp, S. Riedel, S. E. Schulz, R. Wieland, M. Zacher and T. Gessner, Proc. Advanced Metallization Conf. AMC 2001, Montreal, edited by A. J. McKerrow, Y. Shacham-Diamand, S. Zaima, T. Ohba, Materials Research Society, Warrendale, Pennsylvania (2002) 159-165.
4. N. Lietaer et al, Journal of Micromechanics and Microengineering, 16 (6), p. S29-S34, Jun 2006
5. M. Taklo, M. M. Mielnik, K. Schjølberg-Henriksen Kari, P. Storås, H. Rosquist, N. Lietaer, R. Johannessen (2007), "Technologies enabling 3D stacking of MEMS", IEEE workshop on 3D System Integration, München, okt 01-okt 02
6. Kulicke and Soffa Ind Inc, 1005 Virginia Drive, Fort Washington, PA 19034, USA
7. Datacon semiconductor, Innstrasse 16, A-6240 Radfeld, Austria
8. Infineon Technology SensoNor, Knudsrødveien 7, N-3192 Horten, Norway
9. A. Klumpp, R. Merkel, P. Ramm, J. Weber, R. Wieland: "Vertical System Integration by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding", Japanese Journal of Applied Physics Vol. 43, No. 7A (2004), pp. L829-830.