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Volumn 6, Issue 24, 2010, Pages 2847-2852

An effective lift-off method for patterning high-density gold interconnects on an elastomeric substrate

(2) Guo, Liang a Deweerth, Stephen P a

a Emory University (United States)

Author keywords

gold interconnects; high density; lift off metallization; polydimethylsiloxane (PDMS); stretchable electronics

Indexed keywords

ELASTOMERIC SUBSTRATES; GOLD WIRE; HIGH DENSITY; HIGH RESOLUTION; LIFT-OFF METHODS; NEURAL INTERFACES; ORDER OF MAGNITUDE; POLYDIMETHYLSILOXANE (PDMS); STRETCHABLE ELECTRONICS;

GOLD; METALLIZING; MICROCHANNELS;

SILICONES;

DIMETICONE; GOLD;

ARTICLE; CHEMISTRY; ELECTRONICS; METHODOLOGY;

DIMETHYLPOLYSILOXANES; ELECTRONICS; GOLD;

EID: 78650357295 PISSN: 16136810 EISSN: 16136829 Source Type: Journal
DOI: 10.1002/smll.201001456 Document Type: Article

Times cited : (49)

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