Fabrication of organic thin films for copper diffusion barrier layers using molecular layer deposition

Materials Research Society Symposium Proceedings

Volumn 1249, Issue , 2010, Pages 189-194

  Loscutoff, Paul W ^a   Clendenning, Scott B ^b   Bent, Stacey F ^a  

^a Stanford University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING TESTS; BACK-END PROCESSING; BARRIER LAYERS; BARRIER PROPERTIES; BEND TESTING; COPPER DIFFUSION; COPPER DIFFUSION BARRIER; COPPER SURFACE; COUPLING CHEMISTRY; DEVICE-SCALING; DIISOCYANATES; ETHYLENE DIAMINE; FILM PROPERTIES; MOLECULAR LAYER DEPOSITION; NANO SCALE; ORGANIC MOLECULES; ORGANIC THIN FILMS; POLYUREA FILM; TEM; THERMAL STABILITY; THREE SYSTEMS;

ADHESION; COPPER; DEPOSITION; FILM GROWTH; SELF ASSEMBLY; THIN FILMS; VAPOR DEPOSITION;

DIFFUSION BARRIERS;

EID: 78650356986     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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