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Volumn 44, Issue 4 A, 2005, Pages 1626-1628
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Electrical properties of carbon nanotube bundles for future via interconnects
a a a a a a |
Author keywords
Carbon nanotube; Chemical vapor deposition; Interconnect; Resistance; Via
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Indexed keywords
CHEMICAL VAPOR DEPOSITION;
CURRENT DENSITY;
CURRENT VOLTAGE CHARACTERISTICS;
DRY ETCHING;
ELECTRIC POWER SYSTEM INTERCONNECTION;
ELECTRIC RESISTANCE;
FIELD EFFECT TRANSISTORS;
OHMIC CONTACTS;
PHOTOLITHOGRAPHY;
PHOTORESISTORS;
THERMAL CONDUCTIVITY;
TRANSMISSION ELECTRON MICROSCOPY;
CONTACT LAYER;
NANOCLUSTERS;
SINGLE WALL CARBON NANOTUBES (SWN);
VIA;
CARBON NANOTUBES;
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EID: 21244470717
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/JJAP.44.1626 Document Type: Article |
Times cited : (167)
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References (12)
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