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Volumn 44, Issue 4 A, 2005, Pages 1626-1628

Electrical properties of carbon nanotube bundles for future via interconnects

Author keywords

Carbon nanotube; Chemical vapor deposition; Interconnect; Resistance; Via

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CURRENT DENSITY; CURRENT VOLTAGE CHARACTERISTICS; DRY ETCHING; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRIC RESISTANCE; FIELD EFFECT TRANSISTORS; OHMIC CONTACTS; PHOTOLITHOGRAPHY; PHOTORESISTORS; THERMAL CONDUCTIVITY; TRANSMISSION ELECTRON MICROSCOPY;

EID: 21244470717     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.1626     Document Type: Article
Times cited : (167)

References (12)
  • 1
    • 0342819025 scopus 로고
    • S. Iijima: Nature 354 (1991) 56.
    • (1991) Nature , vol.354 , pp. 56
    • Iijima, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.