Fabrication, assembly and heat transfer testing of low-profile copper-based microchannel heat exchangers

Journal of Micromechanics and Microengineering

Volumn 20, Issue 11, 2010, Pages

  Lu, Bin ^a   Chen, Ke ^a   Meng, W J ^a   Mei, Fanghua ^b  

^a Louisiana State University   (United States)

^b Enervana Technologies LLC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

2D FINITE ELEMENT ANALYSIS; COMPUTATIONAL RESULTS; COOLING APPLICATIONS; COPPER-BASED; CU-BASED; GEOMETRIC DIMENSIONS; HEAT TRANSFER PERFORMANCE; HIGH HEAT FLUX; LOW PROFILE; MICROCHANNEL HEAT EXCHANGER; TRANSIENT LIQUID PHASE;

FINITE ELEMENT METHOD; HEAT FLUX; HEAT TRANSFER; MICROCHANNELS;

HEAT EXCHANGERS;

EID: 78649729536     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/11/115002     Document Type: Article

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