Temperature-dependent viscoelasticity in thin AU films and consequences for MEMS devices

Journal of Microelectromechanical Systems

Volumn 19, Issue 6, 2010, Pages 1299-1308

  McLean, Mark ^a   Brown, Walter L ^a   Vinci, Richard P ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

Materials testing; microelectromechanical devices; stress measurement

Indexed keywords

ANALYTICAL MODEL; AU FILM; CONTACT SWITCHES; DEVICE PERFORMANCE; EXPONENTIALS; GAS PRESSURES; MASTER CURVE; MECHANICAL BEHAVIOR; MEMSDEVICES; MICRO-ELECTRO-MECHANICAL; MICROELECTROMECHANICAL SYSTEMS; PRONY SERIES; RELAXATION CURVES; RESTORING FORCES; RF MEMS CAPACITIVE SWITCHES; ROOM TEMPERATURE; SMALL STRAINS; STRUCTURAL COMPONENT; TEMPERATURE DEPENDENCE; TEMPERATURE DEPENDENT; THIN METAL FILMS; TIME TEMPERATURE SUPERPOSITION; TIME-DEPENDENT; TIME-DEPENDENT CHANGES; VISCOELASTIC STRESS;

COMPOSITE MICROMECHANICS; CURVE FITTING; ELASTIC MODULI; ELECTRIC SWITCHES; EXPONENTIAL FUNCTIONS; GOLD; INSTRUMENTS; MATERIALS TESTING; MATHEMATICAL MODELS; MEMS; RESIDUAL STRESSES; STRESS MEASUREMENT; STRESS RELAXATION;

MICROELECTROMECHANICAL DEVICES;

EID: 78649660781     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2076787     Document Type: Article

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