Transmission electron microscopy study on microstructure of Ag-Based conductive adhesives

Materials Transactions

Volumn 51, Issue 10, 2010, Pages 1773-1778

  Kawamoto, Naoyuki ^a   Murakami, Yasukazu ^b   Shindo, Daisuke ^b   Hayasaka, Yuichiro ^b   Kan, Takeshi ^c   Suganuma, Katsuaki ^d  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c Fujikura Kasei Co Ltd   (Japan)

^d OSAKA UNIVERSITY   (Japan)

Author keywords

Conductive adhesive; Conductivity measurement; Discharge; Electric breakdown; Silver paste; Transmission electron microscopy

Indexed keywords

CONDUCTIVE ADHESIVE; CONDUCTIVITY MEASUREMENTS; DISCHARGE; SILVER PASTE; TRANSMISSION ELECTRON;

ADHESIVES; AGGLOMERATION; ELECTRIC BREAKDOWN; ELECTRIC CONDUCTIVITY MEASUREMENT; ELECTRONS; LEAD; MICROSTRUCTURE; TRANSMISSION ELECTRON MICROSCOPY;

SILVER;

EID: 78649385922     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MJ201022     Document Type: Article

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