Focused ion beam technology and application in failure analysis

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 957-960

  Chen, Yuan ^a   Zhang, Xiaowen ^a  

^a Jiangsu Environmental Protection Group Co Ltd   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANALOG TO DIGITAL CONVERTERS; BONDING FAILURE; CIRCUIT MODIFICATION; CIRCUIT TEST; DEFECT LOCALIZATIONS; DIELECTRIC BREAKDOWNS; EDS ANALYSIS; ELECTRON-BEAM PROBING; EMISSION MICROSCOPY; FIB MILLING; FOCUSED ION BEAM TECHNOLOGY; KIRKENDALL EFFECTS; MASK REPAIR; METAL LINE; METALLIZATIONS; MICRO-CUTTING; OPERATING PRINCIPLES; PASSIVATION LAYER; PASSIVE VOLTAGE CONTRASTS; POLYSILICON LINES; PROBE PADS; SITE-SPECIFIC; SPECIFIC LOCATION; SUCCESSFUL CASE; TRANSMISSION ELECTRON MICROSCOPE;

ALUMINUM; ANALOG TO DIGITAL CONVERSION; DEFECTS; ELECTRIC BREAKDOWN; ELECTRON BEAMS; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FOCUSED ION BEAMS; GOLD; LIQUID CRYSTALS; LOCATION; METAL ANALYSIS; METALS; MILLING (MACHINING); PACKAGING; PASSIVATION; PHOTOMASKS; POLYSILICON; SPECIMEN PREPARATION; TECHNOLOGY; TRANSMISSION ELECTRON MICROSCOPY; VOLTAGE MEASUREMENT;

QUALITY ASSURANCE;

EID: 78449298775     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582645     Document Type: Conference Paper

References (12)

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