Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nanoTiO2 alloys and Cu substrate

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 190-194

  Tsao, L C ^a   Lo, T T ^b   Peng, S F ^a  

^a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; CROSS-SECTIONAL MICROSTRUCTURE; CU SUBSTRATE; CU-SN INTERMETALLICS; DIFFUSION CONTROLLED; ELECTRICAL COMPONENTS; IMAGING SOFTWARE; INTERFACIAL INTERMETALLICS; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; KINETICS ANALYSIS; LEAD-FREE; MATRIX; NANO POWDERS; NANO-TIO; REFLOW--SOLDERING; SAC-SOLDERS; SCALLOP-SHAPED; SEM; SEM MICROGRAPHS; SOLDERING REACTIONS; TIO;

ACTIVATION ANALYSIS; ACTIVATION ENERGY; CHIP SCALE PACKAGES; ENERGY DISPERSIVE SPECTROSCOPY; FLIP CHIP DEVICES; GROWTH KINETICS; INTERMETALLICS; NANOSTRUCTURED MATERIALS; PACKAGING; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING; SUBSTRATES; TIN;

SOLDERING ALLOYS;

EID: 78449296042     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582449     Document Type: Conference Paper

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