Application of WLP with Barrier trench structure in precision screen printing technology by glass frit

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 71-73

  Chen, Xiao ^a,b   Yan, Pei Li ^a   Tang, Jia Jie ^a,b   Ning, Wen Guo ^a,b   Xu, Gao Wei ^a   Luo, Le ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Barrier trench; Glass frit; Hermetic package; MEMS; Screen printing; WLP

Indexed keywords

BARRIER TRENCH; BONDING FORCES; GLASS FRIT; HERMETIC PACKAGES; HERMETIC SEALING; IMPROVED TECHNOLOGY; IN-PROCESS; LEAK TESTS; MECHANICAL SYSTEMS; MEMSDEVICES; NONUNIFORM; PROCESS YIELD; SCREEN PRINTING TECHNOLOGY; SHEAR TESTS; WAFER-LEVEL ENCAPSULATION; WATER TESTS; WLP;

ELECTRONICS PACKAGING; GLASS; PACKAGING; PRINTING PRESSES; SCREEN PRINTING; TECHNOLOGY; WAFER BONDING;

GLASS BONDING;

EID: 78449287570     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582363     Document Type: Conference Paper

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