Demonstration of wafer capping through glass frit bonding and its application on molded platform package

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Volumn , Issue , 2007, Pages 177-180

  Chen, Chien Yu ^a   Hung, Cheng Hui ^a   Jhong, Jhih You ^a   Wang, Feng Yan ^a   Hsaio, Wei Min ^a   Wang, Meng Jen ^a   Wang, Wei Chung ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; FORMING; GLASS; GLASS BONDING; MICROSYSTEMS; MOLDING; OPTICAL DESIGN; TECHNOLOGY;

COMMERCIAL GLASSES; FABRICATION PROCESSES; GLASS FRITS; MEMS PACKAGING; MOLDING PROCESSES; PROCESS CHARACTERIZATION; WAFER FABRICATIONS;

WAFER BONDING;

EID: 48649087643     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433595     Document Type: Conference Paper

References (4)

1. R. Knechtel, "Glass Frit Bonding: an Universal Technology for Wafer Level Encapsulation and Packaging," Microsystem Technologies, Vol. 12, No. 1-2, pp. 63-68, 2005.
2. C.-H. Yun, T.-J. Brosnihan, W.-A. Webster, and J. Villarreal, "Wafer-Level Packaging of MEMS Accelerometers with Through-Wafer Interconnects," Electronic Components and Technology Conference (ECTC), pp. 320-323, 2005.
3. M. Wiemer, J. Frömel, C. Jia and T. Gessner, "Bonding and Contacting of MEMS-structures on Wafer Level," Proceedings of Semiconductor Wafer Bonding VII- Science, Technology and Applications, pp. 58-60, 2003.
4. D. Sparks, J. Trevino, S. Masound-Ansari and N. Najafi, "An All-Glass Chip-Scale MEMS Package with Variable Cavity Pressure," Journal of Micromechanics and Microenginnering, Vol. 16, Issue 11, pp. 2488-2491, 2006.