Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 195-198

  Zhu, Fulong ^a   Song, Shao ^a   Zhang, Wei ^a,b   Liu, Sheng ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUBEI UNIVERSITY OF AUTOMOTIVE TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CONSTANT STRESS; CREEP BEHAVIORS; CREEP DATA; CREEP PROPERTIES; CREEP TESTS; DEFORMATION RESISTANCE; KEY PARTS; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; SOLDER ALLOYS; TEMPERATURE SENSITIVITY;

ALLOYS; CREEP; ELECTRONICS PACKAGING; LEAD; MECHANICAL PROPERTIES; PACKAGING;

CREEP RESISTANCE;

EID: 78449271685     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582445     Document Type: Conference Paper

References (14)

1. J. Cannis, "Green IC Packaging", Adv. Packag. (8) (2001) 33-38
2. Minfu Lu, Wei Ren and Sheng Liu, "A Unique Multi-Axial Thermo-Mechanical Fatigue Tester For Electronic Packaging Materials", The Second International Symposium on Electronic Packaging Technology, Shanghai, Dec.9-12, China, 1996
3. Minfu Lu, and Sheng Liu, "A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials" in Sensing, Modeling and Simulation in Emerging Electronic Packaging, ASME 1996, EEEP, V17, 87-92.
4. Wei Ren, Zhengfang Qian and Sheng Liu, "Scale Effect on Packaging Materials", Proceedings of the 49th Electronic Components and Technology Conference, 1999.
5. Minfu Lu, Wei Ren and Sheng Liu, "Unified multi-axial sub-micron fatigue tester with Applications to Electronic Packaging Materials", Proceedings of the 47th Electronic Components and Technology Conference, 144-148, 1997.
6. Minfu Lu, Zhengfang Qian, WeiRen, ShengLiu, Dongkai Shangguan, "Investigation of Electronic Packaging Materials by Using a 6-Axis Mini Thermo-Mechanical Tester", Int. J. Solids Struct.36 (1999) 65-78.
7. Wei Ren, Zhengfang Qian, Sheng Liu and Dongkai Shangguan, "Thermal Mechanical Properties of Two Solder Alloys", in Applications of Experimental Mechanics to Electronic Packaging, ASME, EEP-Vol.22, AMD-Vol.226, pp.125-130, 1997.
8. Wei Ren, Zhengfang Qian and Sheng Liu, "Thermo-Mechanical Creep of Two Solder Alloys", Proceedings of 48th Electronic Components and Technology Conference, Seattle, Washington, 1998, pp.1431-1437.
9. Fulong Zhu, Honghai Zhang, Rongfeng Guan, Sheng Liu, "Mechanical Properties of a Lead-Free Solder Alloys", Proceedings of 6th International Conference on Electronic Packaging Technology, Shenzhen, China, Aug 30-Sep 2, 2005, pp.466-470.
10. Fulong Zhu, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, Sheng Liu", Mechanical properties investigation of a SnAg solder", Proceedings of 2005 International conference on electronics packaging, Tokyo , Japan , April 13-15, 2005, pp. 208-213.
11. F. Guo, S. Choi, K.N. Subramanian, T.R. Bieler, J.P. Lucas, A. Achari, M. Paruchuri,"Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions ", Materials Science and Engineering A351 (2003) 190-199.
12. Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi, Susumu Hioki, "Tensile properties of Sn-Ag based leadfree solders and strain rate sensitivity", Materials Science and Engineering A366 (2004) 50-55.
13. S. Kikuchi, M. Nishimura, K. Suetsugu, T. Ikari, K. Matsushige, "Strength of bonding interface in lead-free Sn alloy solders", Materials Science and Engineering A319-321 (2001) 475-479.
14. Jie Zhao, Yoshiharu Mutoh, Yukio Miyashita, Lai Wang, "Fatigue crack growth behavior of Sn-Pb and Sn-based lead-free solders", Engineering Fracture Mechanics 70 (2003) 2187-2197.