Scale effect on packaging materials

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1229-1234

  Ren, Wei ^a   Qian, Zhengfang ^a   Liu, Sheng ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; SOLDERING ALLOYS; THICKNESS MEASUREMENT;

FLIP CHIP ON BOARD ASSEMBLY; MATERIAL SELECTION; PROCESS OPTIMIZATION;

ELECTRONICS PACKAGING;

EID: 0032657112     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)