Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester

International Journal of Solids and Structures

Volumn 36, Issue 1, 1999, Pages 65-78

  Lu, Minfu ^a   Qian, Zhengfang ^a   Ren, Wei ^a   Liu, Sheng ^a   Shangguan, Dongkai ^b  

^a WAYNE STATE UNIVERSITY   (United States)

^b FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; FAILURE ANALYSIS; FATIGUE TESTING; FRACTURE; LASER APPLICATIONS; MONITORING; PLASTIC FILMS; SHEAR DEFORMATION; SOLDERING ALLOYS;

LASER MOIRE MEASUREMENT SYSTEM; THERMOMECHANICAL TESTER;

ELECTRONICS PACKAGING;

EID: 0032804354     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(97)00281-3     Document Type: Article

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