Implementation of a thermodynamic framework for damage mechanics of solder interconnect in microelectronic packaging

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn , Issue , 2002, Pages 61-68

  Basaran, Cemal ^a   Tang, Hong ^b  

^a UNIVERSITY AT BUFFALO   (United States)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABAQUS; BEHAVIORAL RESEARCH; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MECHANICAL ENGINEERING; MECHANICS; MICROELECTRONICS; VISCOPLASTICITY;

BALL GRID ARRAY PACKAGES; COMPUTATIONAL SIMULATION; CYCLIC SHEAR; CYCLIC SOFTENING; DAMAGE EVOLUTION; DAMAGE MECHANICS; FINITE ELEMENT PACKAGES; INTERNAL STATE VARIABLES; ISOTROPIC HARDENINGS; MATERIAL DEGRADATION; MICROELECTRONIC PACKAGING; SOLDER ALLOYS; SOLDER JOINTS; THERMO-MECHANICAL LOADING; THERMODYNAMIC FRAMEWORK; THERMOMECHANICAL FATIGUE; VISCOPLASTIC; VISCOPLASTIC MODELS;

FATIGUE DAMAGE;

EID: 78249259396     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-32874     Document Type: Conference Paper

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