When failure analysis meets side-channel attacks

Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)

Volumn 6225 LNCS, Issue , 2010, Pages 188-202

  Di Battista, Jerome ^a,b   Courrege, Jean Christophe ^a   Rouzeyre, Bruno ^b   Torres, Lionel ^b   Perdu, Philippe ^c  

^a Thales ITSEF   (France)

^b UNIV MONTPELLIER   (France)

^c CNES   (France)

Author keywords

Failure analysis; FPGA; Laser stimulation; Light emission; Side channel

Indexed keywords

ELECTRIC POWER UTILIZATION; ELECTROMAGNETIC DISPERSION; EMBEDDED SYSTEMS; FAILURE (MECHANICAL); FAILURE ANALYSIS; FIELD PROGRAMMABLE GATE ARRAYS (FPGA); LIGHT EMISSION; OUTAGES;

CIRCUIT BEHAVIORS; ELECTROMAGNETIC EMISSIONS; EXTRACTION OF INFORMATION; LASER STIMULATION; NORMAL OPERATIONS; SIDE-CHANNEL; SIDE-CHANNEL ANALYSIS; VULNERABILITY ANALYSIS;

SIDE CHANNEL ATTACK;

EID: 78049343769     PISSN: 03029743     EISSN: 16113349     Source Type: Book Series    
DOI: 10.1007/978-3-642-15031-9_13     Document Type: Conference Paper

References (25)

1. Perdu, P.: Contribution a l'Etude et au Developpement de Techniques de Localisation de Defauts dans les Circuits Intgrs VLSI, Ph. D. diss., Bordeaux University (2001)
2. Kocher, P., Jaffe, J., Jun, B.: Differential Power Analysis. In: Wiener, M. (ed.) CRYPTO 1999. LNCS, vol. 1666, pp. 388-397. Springer, Heidelberg (1999)
3. Quisquater, J.-J., Samyde, D.: ElectroMagnetic Analysis (EMA): Measures and Counter-Measures for Smart Cards. In: Attali, S., Jensen, T. (eds.) E-smart 2001. LNCS, vol. 2140, pp. 200-210. Springer, Heidelberg (2001)
4. Barton, D. L., Tangyunyong, P., Soden, J. M., Liang, A. Y., Low, F. J., Zaplatin, A. N., Shivanandan, K., Donohoe, G.: Infrared Light Emission from Semiconductor Devices. In: 22th International Symposium for Testing and Failure Analysis, pp. 9-17 (1996)
5. Ferrigno, J., Hlavac, M.: When AES Blinks: Introducing Optical side-channel. IET Information Security 2(3), 94-98 (2008)
6. Skorobogatov, S.: Using Optical Emission Analysis for Estimating Contribution to Power Analysis. In: 6th Workshop on Fault Diagnosis and Tolerance in Cryptography (FDTC), pp. 111-119. IEEE-CS Press, los Alamitos (2009)
7. Di-Battista, J., Perdu, P., Courrege, J. C., Rouzeyre, B., Torres, L., Lionel: Light emission analysis on FPGA: a new side channel possibility. In: 7th Workshop on Cryptographic Architectures Embedded in Reconfigurable Devices, CryptArchi 2009(2009)
8. Stevens, K. C., Wilson, T. J.: Locating IC Defects in Process Monitors and Test Structures Using Optical Beam Induced Current. Microelectronic Engineering 12, 397-404 (1990)
9. Soelkner, G.: Optical beam testing and its potential for electronic device characterization. Microelectronic Engineering 24, 341-353 (1994)
10. Fritz, J., Lackman, R.: Optical Beam Induced Currents in MOS Transistors. Microelectronic Engineering 12, 381-388 (1990)
11. Skorobogatov, S.: Optically Enhanced Position-Locked Power Analysis. In: Goubin, L., Matsui, M. (eds.) CHES 2006. LNCS, vol. 4249, pp. 61-75. Springer, Heidelberg (2006)
12. Desplats, R., Beaudoin, F., Perdu, P.: Chip Unzip for Backside Sample Preparation. In: 27th International Symposium for Testing and Failure Analysis, pp. 179-187 (2001)
13. Wallinger, T.: Characterization of Device Structure by Spectral Analysis of Photoemission. In: 17th International Symposium for Testing and Failure Analysis, pp. 325-334 (1991)
14. Barton, D. L., Bernhard-Hofer, K., Cole Jr., E. I.: Flip-Chip and Backside techniques. Microelectronics Reliability 39, 721-730 (1999)
15. Baudouin, F.: Localisation de defaut par la face arriere des circuits integres. Ph. D. diss., Bordeaux University, 38-40 (2002)
16. Tsang, J. C., Kash, J. A., Vallett, D. P.: Picosecond imaging circuit analysis. IBM Journal of Research and Development 44, 583-603 (2000)
17. McManus, M. K., Kash, J. A., Steen, S. E., Polansky, S., Tsang, J. C., Knebel, D. R., Huott, W.: Huott: PICA: Backside Failure Analysis of CMOS Circuits Using Picosecond Imaging Circuit Analysis. Microelectronic Reliability 40, 1353-1358 (2000)
18. Kolzer, J., Boit, C., Dallmann, A., Deboy, G., Otto, J., Weinmann, D.: Quantitative Emission Microscopy. Journal of Applied Physics 71(11), R23-R41 (1992)
19. Hamamatsu Photonics, http://www.hamamatsu.com/
20. Actel Proasic3 Handbook: 144, http://www.actel.com/products/pa3/docs.aspx
21. Bevan, R., Knudsen, E.: Ways to Enhance Differential Power Analysis. In: Lee, P. J., Lim, C. H. (eds.) ICISC 2002. LNCS, vol. 2587, pp. 327-342. Springer, Heidelberg (2003)
22. Sanchez, K.: Développement et applications de techniques d'analyse par stimulation dynamique laser pour la localisation de défauts et le diagnostic de circuits intégrés. Ph. D. diss., Bordeaux University (2007)
23. DCG systems, http://www.dcgsystems.com/
24. Brier, E., Clavier, C., Oliver, F.: Correlation Power Analysis with a Leakage Model. In: Joye, M., Quisquater, J.-J. (eds.) CHES 2004. LNCS, vol. 3156, pp. 16-29. Springer, Heidelberg (2004)
25. Bystrov, A., Yakovlev, A., Sokolov, D., Murphy, J.: Design and Analysis of Dual-Rail Circuits for Security Applications. IEEE Transactions on Computers 54(4), 449-460 (2005)