Analysis of silicon via hole drilling for wafer level chip stacking by UV laser

International Journal of Precision Engineering and Manufacturing

Volumn 11, Issue 4, 2010, Pages 501-507

  Lee, Young Hyun ^a   Choi, Kyung Jin ^a  

^a Kangnam University   (South Korea)

Author keywords

Laser micromachining; Laser via hole drilling; Silicon wafer

Indexed keywords

EID: 78049258400     PISSN: 12298557     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12541-010-0055-7     Document Type: Article

References (19)

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