-
1
-
-
0036536079
-
Thermometry and thermal transport in micro/nanoscale solid-state devices and structures
-
DOI 10.1115/1.1454111, Micro/nanoscale heat transfer
-
D. G. Cahill, K. Goodson, and A. Majumdar, ASME J. Heat Transfer JHTRAO 0022-1481 124, 223 (2002). 10.1115/1.1454111 (Pubitemid 34416290)
-
(2002)
Journal of Heat Transfer
, vol.124
, Issue.2
, pp. 223-241
-
-
Cahill, D.G.1
Goodson, K.2
Majumdar, A.3
-
2
-
-
0033225794
-
-
JAPLD8 0021-4922, 10.1143/JJAP.38.L1268
-
N. Taketoshi, T. Baba, and A. Ono, Jpn. J. Appl. Phys., Part 2 JAPLD8 0021-4922 38, L1268 (1999). 10.1143/JJAP.38.L1268
-
(1999)
Jpn. J. Appl. Phys., Part 2
, vol.38
, pp. 1268
-
-
Taketoshi, N.1
Baba, T.2
Ono, A.3
-
3
-
-
0036001781
-
-
HTHPAK 0018-1544, 10.1068/htwu125
-
N. Taketoshi, T. Baba, and A. Ono, High Temp.-High Press. HTHPAK 0018-1544 34, 19 (2002). 10.1068/htwu125
-
(2002)
High Temp. - High Press.
, vol.34
, pp. 19
-
-
Taketoshi, N.1
Baba, T.2
Ono, A.3
-
4
-
-
0031097335
-
-
RSINAK 0034-6748, 10.1063/1.1147638
-
G. Langer, J. Hartmann, and M. Reichling, Rev. Sci. Instrum. RSINAK 0034-6748 68, 1510 (1997). 10.1063/1.1147638
-
(1997)
Rev. Sci. Instrum.
, vol.68
, pp. 1510
-
-
Langer, G.1
Hartmann, J.2
Reichling, M.3
-
5
-
-
77649141256
-
-
THSFAP 0040-6090, 10.1016/j.tsf.2009.09.180
-
N. Oka, R. Arisawa, A. Miyamura, Y. Sato, T. Yagi, N. Taketoshi, T. Baba, and Y. Shigesato, Thin Solid Films THSFAP 0040-6090 518, 3119 (2010). 10.1016/j.tsf.2009.09.180
-
(2010)
Thin Solid Films
, vol.518
, pp. 3119
-
-
Oka, N.1
Arisawa, R.2
Miyamura, A.3
Sato, Y.4
Yagi, T.5
Taketoshi, N.6
Baba, T.7
Shigesato, Y.8
-
6
-
-
20544465439
-
Optical pump-and-probe test system for thermal characterization of thin metal and phase-change films
-
DOI 10.1364/AO.44.003167
-
K. Watabe, P. Polynkin, and M. Mansuripur, Appl. Opt. APOPAI 0003-6935 44, 3167 (2005). 10.1364/AO.44.003167 (Pubitemid 40844313)
-
(2005)
Applied Optics
, vol.44
, Issue.16
, pp. 3167-3173
-
-
Watabe, K.1
Polynkin, P.2
Mansuripur, M.3
-
7
-
-
0035519155
-
Thermal conductivity measurements of thin-film resist
-
DOI 10.1116/1.1421557, 45th International COnference on Electron, Ion, and Photon Beam Technology and Nanofabrication
-
D. Chu, M. Touzelbaev, K. E. Goodson, S. Babin, and R. F. Pease, J. Vac. Sci. Technol. B JVTBD9 1071-1023 19, 2874 (2001). 10.1116/1.1421557 (Pubitemid 34089846)
-
(2001)
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
, vol.19
, Issue.6
, pp. 2874-2877
-
-
Chu, D.1
Touzelbaev, M.2
Goodson, K.E.3
Babin, S.4
Pease, R.F.5
-
8
-
-
0030408641
-
Non-destructive evaluation of thin film coatings using a laser-induced surface thermal lensing effect
-
DOI 10.1016/S0040-6090(96)09055-4, PII S0040609096090554
-
Z. L. Wu, P. K. Kuo, Y. S. Lu, S. T. Gu, and R. Krupka, Thin Solid Films THSFAP 0040-6090 290-291, 271 (1996). 10.1016/S0040-6090(96)09055-4 (Pubitemid 126391102)
-
(1996)
Thin Solid Films
, vol.290-291
, pp. 271-277
-
-
Wu, Z.L.1
Kuo, P.K.2
Lu, Y.S.3
Gu, S.T.4
Krupka, R.5
-
9
-
-
84975598532
-
-
APOPAI 0003-6935, 10.1364/AO.31.002047
-
H. Saito, M. Irikura, M. Haraguchi, and M. Fukui, Appl. Opt. APOPAI 0003-6935 31, 2047 (1992). 10.1364/AO.31.002047
-
(1992)
Appl. Opt.
, vol.31
, pp. 2047
-
-
Saito, H.1
Irikura, M.2
Haraguchi, M.3
Fukui, M.4
-
10
-
-
0000067550
-
-
APOPAI 0003-6935, 10.1364/AO.29.005326
-
P. -K. Kuo and M. Munidasa, Appl. Opt. APOPAI 0003-6935 29, 5326 (1990). 10.1364/AO.29.005326
-
(1990)
Appl. Opt.
, vol.29
, pp. 5326
-
-
Kuo, P.-K.1
Munidasa, M.2
-
11
-
-
77955960123
-
-
APOPAI 0003-6935, 10.1364/AO.49.002547
-
J. -P. Bourgoin, G. -G. Allogho, and A. Hach́, Appl. Opt. APOPAI 0003-6935 49, 2547 (2010). 10.1364/AO.49.002547
-
(2010)
Appl. Opt.
, vol.49
, pp. 2547
-
-
Bourgoin, J.-P.1
Allogho, G.-G.2
Hach́, A.3
-
12
-
-
0042268082
-
-
APPLAB 0003-6951, 10.1063/1.1589199
-
D. Comeau and A. Hach́, Appl. Phys. Lett. APPLAB 0003-6951 83, 246 (2003). 10.1063/1.1589199
-
(2003)
Appl. Phys. Lett.
, vol.83
, pp. 246
-
-
Comeau, D.1
Hach́, A.2
-
13
-
-
3442882488
-
-
APOPAI 0003-6935, 10.1364/AO.43.004250
-
S. Doiron and A. Hach́, Appl. Opt. APOPAI 0003-6935 43, 4250 (2004). 10.1364/AO.43.004250
-
(2004)
Appl. Opt.
, vol.43
, pp. 4250
-
-
Doiron, S.1
Hach́, A.2
-
15
-
-
77958172413
-
-
Micro Slides 2947, Corning Glass Works, NY, USA
-
Micro Slides 2947, Corning Glass Works, NY, USA.
-
-
-
-
16
-
-
0035656747
-
Development of a thermal diffusivity measurement system for metal thin films using a picosecond thermoreflectance technique
-
DOI 10.1088/0957-0233/12/12/306, PII S0957023301255568
-
N. Taketoshi, T. Baba, and A. Ono, Meas. Sci. Technol. MSTCEP 0957-0233 12, 2064 (2001). 10.1088/0957-0233/12/12/306 (Pubitemid 34010435)
-
(2001)
Measurement Science and Technology
, vol.12
, Issue.12
, pp. 2064-2073
-
-
Taketoshi, N.1
Baba, T.2
Ono, A.3
-
17
-
-
0003397084
-
-
10th ed. (McGraw-Hill, New York)
-
J. P. Holman, Heat Transfer, 10th ed. (McGraw-Hill, New York, 2010).
-
(2010)
Heat Transfer
-
-
Holman, J.P.1
-
18
-
-
0003782321
-
-
3rd ed. (McGraw-Hill, New York)
-
W. M. Rohsenow, J. P. Hartnett, and Y. I. Cho, Handbook of Heat Transfer, 3rd ed. (McGraw-Hill, New York, 1998).
-
(1998)
Handbook of Heat Transfer
-
-
Rohsenow, W.M.1
Hartnett, J.P.2
Cho, Y.I.3
-
19
-
-
33750290298
-
Influence of grain boundary scattering on the electrical and thermal conductivities of polycrystalline gold nanofilms
-
DOI 10.1103/PhysRevB.74.134109
-
Q. G. Zhang, B. Y. Cao, X. Zhang, M. Fujii, and K. Takahashi, Phys. Rev. B PLRBAQ 0556-2805 74, 134109 (2006). 10.1103/PhysRevB.74.134109 (Pubitemid 44631167)
-
(2006)
Physical Review B - Condensed Matter and Materials Physics
, vol.74
, Issue.13
, pp. 134109
-
-
Zhang, Q.G.1
Cao, B.Y.2
Zhang, X.3
Fujii, M.4
Takahashi, K.5
-
20
-
-
5544223774
-
Laser-induced Damage in Optical Materials
-
H. E. Bennett, L. L. Chase, A. H. Guenther, B. E. Newnam, and M. J. Soileau, Eds.
-
Z. L. Wu, M. Reichling, H. Grönbeck, Z. X. Fan, D. Schaefer, and E. Matthias, Laser-induced Damage in Optical Materials, H. E. Bennett, L. L. Chase, A. H. Guenther, B. E. Newnam, and, M. J. Soileau, Eds., Proc. SPIE 1624, 331 (1991).
-
(1991)
Proc. SPIE
, vol.1624
, pp. 331
-
-
Wu, Z.L.1
Reichling, M.2
Grönbeck, H.3
Fan, Z.X.4
Schaefer, D.5
Matthias, E.6
-
21
-
-
33750980409
-
Thermal diffusivity of metallic thin films: Au, Sn, Mo, and Al/Ti alloy
-
DOI 10.1007/s10765-006-0118-2
-
S. R. Choi, D. Kim, and S. Choa, Int. J. Thermophys. IJTHDY 0195-928X 27, 1551 (2006). 10.1007/s10765-006-0118-2 (Pubitemid 44745992)
-
(2006)
International Journal of Thermophysics
, vol.27
, Issue.5
, pp. 1551-1563
-
-
Choi, S.R.1
Kim, D.2
Choa, S.-H.3
-
22
-
-
0000178254
-
-
APPLAB 0003-6951, 10.1063/1.123973
-
G. Chen and P. Hui, Appl. Phys. Lett. APPLAB 0003-6951 74, 2942 (1999). 10.1063/1.123973
-
(1999)
Appl. Phys. Lett.
, vol.74
, pp. 2942
-
-
Chen, G.1
Hui, P.2
-
23
-
-
35148898908
-
Thin-film thermal conductivity measurement using microelectrothermal test structures and finite-element-model-based data analysis
-
DOI 10.1109/JMEMS.2007.900877
-
N. Stojanovic, J. Yun, E. B. K. Washington, J. M. Berg, M. W. Holtz, and H. Temkin, J. Microelectromech. Syst. JMIYET 1057-7157 16, 1269 (2007). 10.1109/JMEMS.2007.900877 (Pubitemid 47532916)
-
(2007)
Journal of Microelectromechanical Systems
, vol.16
, Issue.5
, pp. 1269-1275
-
-
Stojanovic, N.1
Yun, J.2
Washington, E.B.K.3
Berg, J.M.4
Holtz, M.W.5
Temkin, H.6
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