Novel methods for modeling of multiple vias in multilayered parallel-plate structures

IEEE Transactions on Microwave Theory and Techniques

Volumn 57, Issue 1, 2009, Pages 1724-1733

  Liu, En Xiao ^a   Li, Er Ping ^a   Oo, Zaw Zaw ^a   Wei, Xingchang ^a   Zhang, Yaojiang ^a   Vahldieck, Rüdiger ^b  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b ETH ZURICH   (Switzerland)

Author keywords

Boundary modeling; Generalized T matrix; Highspeed electronic package modeling; Modal expansion; Signal and power integrity; Via coupling

Indexed keywords

BOUNDARY MODELING; HIGH-SPEED ELECTRONICS; MODAL EXPANSION; POWER INTEGRITY; T-MATRIX; VIA COUPLING;

CYLINDERS (SHAPES); ELECTRIC CURRENT CONTROL; EXPANSION; MODAL ANALYSIS; NUMERICAL METHODS; PLASMONS;

PLATES (STRUCTURAL COMPONENTS);

EID: 77958087118     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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