Specimen alignment in an axial tensile test of thin films using direct imaging and its influence on the mechanical properties of BeCu

Journal of Micromechanics and Microengineering

Volumn 20, Issue 8, 2010, Pages

  Kang, Dong Joong ^a   Park, Jun Hyub ^b   Shin, Myung Soo ^b   Ha, Jong Eun ^c   Lee, Hak Joo ^d  

^a Pusan National University   (South Korea)

^b Tongmyong University   (South Korea)

^c Seoul National University of Science and Technology   (South Korea)

^d Korea Institute of Machine and Materials   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRESS; DIGITAL IMAGE PROCESSING; DIGITAL IMAGING; DIRECT IMAGING; DISPLACEMENT CONTROL; IMAGE RECOGNITION SYSTEM; IN-PLANE; METAL THIN FILM; MICROMETER SIZES; NEW SYSTEM; OUT-OF-PLANE; PROBABILISTIC ANALYSIS; ROOM TEMPERATURE; STRESS GRADIENT; TENSILE SPECIMENS; TENSILE TESTS; TEST SPECIMENS;

ALIGNMENT; BENDING TESTS; BERYLLIUM; FEATURE EXTRACTION; IMAGE PROCESSING; IMAGE RECOGNITION; MECHANICAL PROPERTIES; TESTING; THIN FILMS; VAPOR DEPOSITION;

TENSILE TESTING;

EID: 77957871779     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/8/085001     Document Type: Article

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