Role of length scale and temperature in indentation induced creep behavior of polymer derived Si-C-O ceramics

Materials Science and Engineering: A

Volumn 527, Issue 29-30, 2010, Pages 7615-7623

  Gan, Ming ^a   Tomar, Vikas ^a  

^a Purdue University   (United States)

Author keywords

Creep; Polymer derived ceramic; Scale dependence; Si C O; Temperature dependence

Indexed keywords

CERAMIC COATINGS; CERAMIC MATERIALS; CREEP; ELASTIC MODULI; NANOTECHNOLOGY; PILES; SILICON COMPOUNDS; STRAIN HARDENING; STRAIN RATE; TEMPERATURE DISTRIBUTION;

CREEP BEHAVIORS; DEFORMATION MECHANISM; LENGTH SCALE; MICRO INDENTATION; NANO INDENTATION; NANO SCALE; POLYMER-DERIVED CERAMICS; SCALE DEPENDENCE; SI-C-O; TEMPERATURE DEPENDENCE;

HARDNESS;

EID: 77957679182     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.08.016     Document Type: Article

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