Chemical vapour deposition and atomic layer deposition of amorphous and nanocrystalline metallic coatings: Towards deposition of multimetallic films

Journal of Alloys and Compounds

Volumn 504, Issue SUPPL. 1, 2010, Pages

  Blanquet, Elisabeth ^a   Mantoux, Arnaud ^a   Pons, Michel ^a   Vahlas, Constantin ^b  

^a UNIV GRENOBLE ALPES   (France)

^b INSTITUT CARNOT CIRIMAT   (France)

Author keywords

ALD; CVD; Thermodynamics; Thin films

Indexed keywords

ALD; APPLICATION FIELDS; CHEMICAL VAPOUR DEPOSITION; CVD; DEPOSITION PARAMETERS; DEPOSITION PROCESS; METALLIC COATING; METALLIC GLASS THIN FILMS; METALLIC THIN FILMS; METALORGANIC CHEMICAL VAPOUR DEPOSITION; MOCVD; NANOCRYSTALLINES; PHASE MATERIALS; PHYSICOCHEMICAL PROPERTY; PROCESSING APPROACH; SINGLE ELEMENT; THERMO DYNAMIC ANALYSIS;

AMORPHOUS FILMS; ATOMIC LAYER DEPOSITION; CHEMICAL ELEMENTS; CHEMICAL PROPERTIES; DEPOSITION; GLASS; METALLIC GLASS; MICROELECTRONICS; PROTECTIVE COATINGS; THERMOANALYSIS; THERMODYNAMICS; THIN FILMS;

CHEMICAL VAPOR DEPOSITION;

EID: 77957552530     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.03.205     Document Type: Article

References (23)

1. A. Inoue Acta Mater. 48 2000 279 306
2. A.L. Greer Science 267 1995 1947 1953
3. P. Sharma, N. Kaushik, H. Kimura, Y. Saotome, and A. Inoue Nanotechnology 18 2007 035302, 1-6
4. C.A. Volkert, A. Donohue, and F. Spaepen J. Appl. Phys. 103 2008 083539, 1-6
5. A. Dubach, R. Raghavan, J.F. Löffler, J. Michler, and U. Ramamurty Scripta Mater. 60 2009 567 570
6. K. Kondoh, K. Kawabata, T. Serikawa, and H. Mikura Trans. JWRI 37 1 2008 109 112
7. N. Karpe, J. Bøttiger, J.P. Krog, A. Nordström, and Ö. Rapp Thin Solid Films 275 1996 82 86
8. J. Kim, C. Lee, H. Choi, H. Jo, and H. Kim Mater. Sci. Eng. A 449-451 2007 858 862
9. A. Brenner, D.E. Couch, and E.K. Williams J. Res. Natl. Bur. Stand. 44 1950 109
10. C. Suryanarayana A Bibliography 1973-1979 for Rapidly Quenched Metals 1980 Plenum New York
11. W.H. Wang, C. Dong, and C.H. Shek Mater. Sci. Eng. R44 2004 45 89
12. J. Kramer Ann. Phys. (Paris) 19 1934 37
13. SGTE, B.P. 166, 38402 Saint Martin d'Hres, France, http://www.sgte.org.
14. V.V. Krisyuk, L. Aloui, N. Prud'homme, B. Sarapata, F. Senocq, D. Samélor, and C. Vahlas ECS Trans. 25 8 2009 581 586
15. M. Juppo J. Vac. Sci. Technol. A A15 1997 2330 2333
16. P. Doppelt Coord. Chem. Rev. 178-180 Part 2 1998 1785 1809
17. J.S. Thompson et al., US Patent 0099343 A1 (2006).
18. A.Z. Bradly et al., US Patent 0227007 A1 (2005).
19. Z.W. Li, S.T. Barry, and R.G. Gordon Inorg. Chem. 44 2005 1728 1735
20. B.S. Lim, A. Rahtu, and J.S. Park Inorg Chem. 42 2003 7951 7958
21. T.T. Kodas, and M.J. Hampden-Smith The Chemistry of Metal CVD 1994 VCH Weinheim, Germany
22. D. Monnier, I. Nuta, C. Chatillon, M. Gros-Jean, F. Volpi, and E. Blanquet J. Electrochem. Soc. 156 1 2009 71 75
23. J.G. Kim, D.J. Choi, D.K. Kim, Y.W. Lee, and J.Y. Park J. Ceram. Process. Res. 10 1 2009 21 24