CVD of pure copper films from a novel amidinate precursor

ECS Transactions

Volumn 25, Issue 8 PART 1, 2009, Pages 581-586

  Krisyuk, V V ^a,b   Aloui, L ^a   Prud'homme, N ^a   Sarapata, B ^a   Senocq, F ^a   Samelor D ^a   Vahlas, C ^a  

^a INSTITUT CARNOT CIRIMAT   (France)

^b NIKOLAEV INSTITUTE OF INORGANIC CHEMISTRY   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

AMIDINATES; CARBON AND NITROGEN; COPPER FILMS; EPMA; LOW PRESSURE CVD; POLYCRYSTALLINE COPPER; PURE COPPER; SI SUBSTRATES; TEMPERATURE RANGE; TOTAL PRESSURE; XRD;

CARBON FILMS; COPPER; COPPER PLATING; ELECTRON PROBE MICROANALYSIS; METALLIC FILMS; SILICON COMPOUNDS; SILICON OXIDES;

CHEMICAL VAPOR DEPOSITION;

EID: 76549116189     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3207643     Document Type: Conference Paper

References (9)

1. P. P. Choi, T. Al-Kassab and R. Kirchheim, Scripta Materialia, 53, 323 (2005).
2. W. R. Osorio, J. E. Spinelli, C. M. A. Freire, M. B. Cardona and A. Garcia, Journal of Alloys and Compounds, 443, 87 (2007).
3. C. Dong, Q. Zhang, D. Wang and Y, Wang, Micron, 31, 507 (2000).
4. B. S. Lim, A. Rahtu, J.-S. Park and R. G. Gordon, Inorg. Chem., 42, 7951 (2003).
5. B. S. Lim, A. Rahtu and R. Gordon, Nature: Materials, 2, 749 (2003).
6. F. Juarez L., M.-C. Lafont, F. Senocq and C. Vahlas, Chemical Vapor Deposition XVI and EUROCVD14, M. D. Allendorf, F. Teyssandier and F. Maury, Editors, The Electrochemical Soc. PV 2003-08, p. 538.
7. P. Tobaly and G. Lanchec, J. Chem. Thermodynamics, 25, 503 (1993).
8. Y. Maekawa, H. Koshikawa and M. Yoshida, Polymer, 45, 2291 (2004).
9. X. Wang, X. Dong, C. Jiang and J. Wu. Surface and Coatings Technology, (2009) in press, available online 18 March 2009.