Wafer-level fabrication of ball lens by cross-cut and reflow of wafer-bonded glass on silicon

Journal of the Optical Society of Korea

Volumn 14, Issue 2, 2010, Pages 163-169

  Lee, Dong Whan ^a   Oh, Jin Kyung ^a   Choi, Jun Seok ^a   Lee, Hyung Jong ^a   Chung, Woo Nam ^a  

^a Chonnam National University   (South Korea)

Author keywords

Ball; Borosilicate; Glass; Lens; Micro

Indexed keywords

BALL; BALL DIAMETER; BALL LENS; BOROSILICATE; GLASS BALLS; MAXIMUM EFFICIENCY; MICRO; OPTICAL POWER; OPTOELECTRONIC APPLICATIONS; PYREX WAFERS; RADIAL VARIATIONS; SILICON SUPPORT; THERMAL REFLOW; WAFER-LEVEL FABRICATION;

BOROSILICATE GLASS; ETCHING; LENSES; OPTICAL INSTRUMENTS; SILICON WAFERS; SPHERES; SURFACE ROUGHNESS; WAFER BONDING;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 77957101684     PISSN: 12264776     EISSN: None     Source Type: Journal    
DOI: 10.3807/JOSK.2010.14.2.163     Document Type: Article

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