Wafer-level packaging technology for 10Gbps TOSAs

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1325-1332

  Sherrer, David W ^a   Brese, Nate ^a   Fisher, John ^a   Gaebe, Carl ^a   Heiks, Noel A ^a   Getz, James ^a   Rasnake, Jasean ^a   Simon, Ethan S ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HERMETIC OPTOELECTRONICS PACKAGE; HERMETIC SEALING; SILICON OPTICAL BENCH (SIOB); WAFER-LEVEL PACKAGING TECHNOLOGY;

COSTS; ELECTRONICS INDUSTRY; HELIUM; HERMETIC DEVICES; OPTOELECTRONIC DEVICES; SILICON WAFERS; THERMAL CONDUCTIVITY;

ELECTRONICS PACKAGING;

EID: 24644521716     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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