Microsystems and waferprocesses for volume production of highly reliable fiber optic components for telecom- and datacom-application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 7-15

  Althaus, Hans L ^a   Gramann, Wolfgang ^a   Panzer, Klaus ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DATA COMMUNICATION SYSTEMS; ELECTRONICS PACKAGING; MICROELECTRONICS; RELIABILITY; SILICON WAFERS; SOLDERING;

MICROSYSTEMS;

FIBER OPTIC COMPONENTS;

EID: 0030678668     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)