Interface crack initiation due to nano-scale stress concentration

Materials Science and Engineering: A

Volumn 527, Issue 18-19, 2010, Pages 4796-4803

  Sumigawa, Takashi ^a   Shishido, Tetsuya ^a   Murakami, Tadashi ^a   Kitamura, Takayuki ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Crack; Initiation; Interface; Nano scale; Stress concentration; Thin film

Indexed keywords

CRACK INITIATION; INTERFACES (MATERIALS); NANOTECHNOLOGY; STRESS CONCENTRATION;

CRACKS INITIATIONS; INITIATION; INTERFACE CRACK INITIATIONS; INTERFACE EDGES; INTERFACIAL CRACKS; MECHANICAL FACTORS; NANO SCALE; SCALE STRESS; SILICON INTERFACE; THIN-FILMS;

THIN FILMS;

EID: 77955924974     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.04.002     Document Type: Article

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