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Volumn 518, Issue 21, 2010, Pages 6040-6047
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Evaluation on plastic deformation property of copper nano-film by nano-scale cantilever specimen
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Author keywords
Constitutive equation; Copper; Deformation; Finite element method; Inverse analysis; Thin films
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Indexed keywords
BENDING EXPERIMENTS;
BOTTOM SURFACES;
CU FILMS;
CU THIN FILM;
ELASTOPLASTIC DEFORMATION;
HARDENING LAWS;
INVERSE ANALYSIS;
MULTI-LAYER THIN FILM;
NANO SCALE;
NON-LINEARITY;
SILICON SUBSTRATES;
ATOMIC FORCE MICROSCOPY;
CONSTITUTIVE EQUATIONS;
COPPER;
FILM PREPARATION;
MULTILAYER FILMS;
MULTILAYERS;
NANOCANTILEVERS;
NANOSTRUCTURED MATERIALS;
PHOTORESISTS;
PLASTIC DEFORMATION;
PLASTICS;
RESIDUAL STRESSES;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON NITRIDE;
VAPOR DEPOSITION;
YIELD STRESS;
FINITE ELEMENT METHOD;
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EID: 77955549793
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2010.06.039 Document Type: Article |
Times cited : (35)
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References (16)
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