Temperature dependent fracture toughness of glass frit bonding layers

Microsystem Technologies

Volumn 16, Issue 7, 2010, Pages 1243-1249

  Nötzold, Kerstin ^a   Dresbach, Christian ^b   Graf, Jürgen ^a   Böttge, Bianca ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING LAYERS; FINITE ELEMENT SIMULATIONS; GLASS FRIT; INTERFACIAL CRACKS; LOADING CONDITION; SHEAR LOADINGS; STABILITY ASSESSMENT; TEMPERATURE CHANGES; TEMPERATURE DEPENDENT; WAFER BONDING PROCESS;

CRACK TIPS; FRACTURE TOUGHNESS; GLASS; RESIDUAL STRESSES; SYSTEM STABILITY; WAFER BONDING;

GLASS BONDING;

EID: 77955849472     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-010-1037-5     Document Type: Conference Paper

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