Mechanical properties of glass frit bonded micro packages

Microsystem Technologies

Volumn 12, Issue 5, 2006, Pages 473-480

  Dresbach, C ^a   Krombholz, A ^a   Ebert, M ^a   Bagdahn, J ^a  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTERS; ELECTRODES; FINITE ELEMENT METHOD; PROSTHETICS;

NEURAL PROSTHESES; RECRUITMENT ORDER; SELECTIVE NEURAL STIMULATION;

NEUROLOGY;

EID: 33645161434     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0031-9     Document Type: Conference Paper

References (11)

1. Bagdahn J (2000) Festigkeit und Lebensdauer direkt gebondeter Siliziumwafer unter mechanischer Belastung. PhD Theses, MLU Halle-Wittenberg
2. Bagdahn J et al. (2002) Influence of the frequency on fatigue of directly wafer-bonded silicon. Fatigue
3. Brown et al. (1992) Chevron-notch test experience, metals and nonmetals. ASTM Philadelphia, ASTM PLN 04-011720-30
4. Choong Chong S et al. (2003) Effect of passivation on frit glass bonding method for wafer level hermetic sealing on MEMES devices. In: Proceedings of 5th EPIC 2003, 5th conference, pp 307-310
5. Ebert M, Bagdahn J (2004) Determination of residual stress in glass frit bonded MEMS by Finite Element Analysis. In: Proceedings of 5th EuroSimE, pp 407-412
6. Glien K et al. (2004) Strength and reliability properties of glass frit bonded micro packages. In: Proceedings of DTIP, Montreux, Switzerland, pp 119-124
7. Knechtel R (2004) Glass frit bonding - an universal technology for wafer level encapsulation and packaging. Proceedings of DTIP, Montreux, Switzerland, pp 77-82
8. Munz D et al. (1989) Mechanisches Verhalten Keramischer Werkstoffe. Springer, Berlin Heidelberg New York
9. Murakami Y (1990) Stress intensity factors handbook. Pergamon, Oxford
10. Petzold M (2001) Strength assessment of wafer-bonded micromechanical components using the micro chevron test, reliability, testing, and characterization of MEMS and MOEMS conference, San Francisco, USA, 22-24 October 2001
11. Petzold M et al. (2001) Strength assessment of wafer-bonded micromechanical components using the Micro-Chevron-Test'. Proceedings of the SPIE4558, San Francisco, USA, pp 133-142