Mechanical characterization and micro structure diagnostics of glass frit bonded interfaces

ECS Transactions

Volumn 16, Issue 8, 2009, Pages 441-448

  Boettge, B ^a   Dresbach, C ^a   Graff, A ^a   Petzold, M ^a   Bagdahn, J ^a  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS; LEAD METALLOGRAPHY; REACTION INTERMEDIATES; REDOX REACTIONS; SILICON WAFERS; TENSILE TESTING;

BONDED INTERFACE; GLASS FRIT; INTERMEDIATE LAYERS; MECHANICAL CHARACTERIZATIONS; RELIABILITY RISKS; SEM AND TEM; SILICON INTERFACE; STRENGTH PROPERTY;

WAFER BONDING;

EID: 63149175341     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2982898     Document Type: Conference Paper

References (9)

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