Reliability aspects of microsystems for automotive applications

Advanced Engineering Materials

Volumn 11, Issue 4, 2009, Pages 316-323

  Müller Fiedler, Roland ^a   Nötzold, Kerstin ^a   Schneider, Arnold ^a   Rank, Holger ^a   Graf, Jürgen ^a  

^a ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE APPLICATIONS; AUTOMOTIVE SYSTEMS; BONDING TECHNOLOGIES; CHARACTERIZATION METHODS; DRIVING FORCES; FAILSAFE; GLASS FRITS; HARSH ENVIRONMENTS; INDUSTRIAL TECHNOLOGIES; MASS PRODUCTIONS; MATERIAL COMBINATIONS; MATERIAL PARAMETERS; MECHANICAL SYSTEMS; MEMS DEVICES; RESEARCH AND DEVELOPMENT; STABILITY ASSESSMENTS;

AUTOMOBILE PARTS AND EQUIPMENT; MEMS; METALLIC GLASS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; PACKAGING MATERIALS; POWER CONVERTERS; RELIABILITY; SYSTEM STABILITY;

GLASS BONDING;

EID: 64749114471     PISSN: 14381656     EISSN: 15272648     Source Type: Journal    
DOI: 10.1002/adem.200800290     Document Type: Article

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